Minoru Ogawa

Person

Gifu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board assembly and method of manufacturing the same
- Patent number 8,031,474
- Issue date Oct 4, 2011
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and fabricating method of the same
- Patent number 7,642,468
- Issue date Jan 5, 2010
- Sony Corporation
- Masakazu Nakada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring board
- Patent number 7,334,324
- Issue date Feb 26, 2008
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device integrated multilayer wiring board
- Patent number 7,022,399
- Issue date Apr 4, 2006
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, semiconductor device mounting board using...
- Patent number 6,797,367
- Issue date Sep 28, 2004
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of Manufacturing Multilayer Wiring Board
- Publication number 20080116611
- Publication date May 22, 2008
- Sony Corporation
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070176613
- Publication date Aug 2, 2007
- SONY CORPORATION
- Minoru Ogawa
- G02 - OPTICS
Information Patent Application
MULTILAYER WIRING BOARD AND FABRICATING METHOD OF THE SAME
- Publication number 20060274510
- Publication date Dec 7, 2006
- Masakazu Nakada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board, semiconductor device mounting board using...
- Publication number 20050025944
- Publication date Feb 3, 2005
- Sony Corporation
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer wiring board, semiconductor device mounting board using...
- Publication number 20030180510
- Publication date Sep 25, 2003
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device built-in multilayer wiring board and method of...
- Publication number 20030178726
- Publication date Sep 25, 2003
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Minoru Ogawa

Person

Patents Grantslast 30 patents

Printed circuit board assembly and method of manufacturing the same

Multilayer wiring board and fabricating method of the same

Method of manufacturing multilayer wiring board

Semiconductor device integrated multilayer wiring board

Multilayer wiring board, semiconductor device mounting board using...

Patents Applicationslast 30 patents

Method of Manufacturing Multilayer Wiring Board

PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

MULTILAYER WIRING BOARD AND FABRICATING METHOD OF THE SAME

Multilayer wiring board, semiconductor device mounting board using...

Multilayer wiring board, semiconductor device mounting board using...

Semiconductor device built-in multilayer wiring board and method of...