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Wiring component
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Patent number 12,095,110
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Issue date Sep 17, 2024
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Asahi Kasei Kabushiki Kaisha
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Hiroya Yokoyama
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H01 - BASIC ELECTRIC ELEMENTS
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Resin composition and molded product thereof
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Patent number 8,658,731
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Issue date Feb 25, 2014
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ASAHI KASEI CHEMICALS CORPORATION
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Yoshikuni Akiyama
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Resin composition and molded product thereof
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Patent number 8,487,035
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Issue date Jul 16, 2013
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ASAHI KASEI CHEMICALS CORPORATION
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Yoshikuni Akiyama
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Resin composition
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Patent number 8,153,720
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Issue date Apr 10, 2012
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ASAHI KASEI CHEMICALS CORPORATION
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Minoru Sakata
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Polyphenylene sulfide resin composition
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Patent number 7,173,090
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Issue date Feb 6, 2007
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ASAHI KASEI CHEMICALS CORPORATION
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Yoshikuni Akiyama
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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