Minoru Sanada

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for wafer level burn-in
- Patent number 7,940,064
- Issue date May 10, 2011
- Panasonic Corporation
- Terutsugu Segawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe card for semiconductor IC test and method of manufacturing th...
- Patent number 7,768,285
- Issue date Aug 3, 2010
- Panasonic Corporation
- Minoru Sanada
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL BURN-IN METHOD AND WAFER-LEVEL BURN-IN APPARATUS
- Publication number 20090160472
- Publication date Jun 25, 2009
- Matsushita Electric Industrial Co., Ltd.
- Terutsugu Segawa
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR WAFER LEVEL BURN-IN
- Publication number 20090102499
- Publication date Apr 23, 2009
- Matsushita Electric Industrial Co., Ltd.
- Terutsugu Segawa
- G01 - MEASURING TESTING
Information Patent Application
Probe card for semiconductor IC test and method of manufacturing th...
- Publication number 20080150563
- Publication date Jun 26, 2008
- Matsushita Electric Industrial Co., Ltd.
- Minoru Sanada
- G01 - MEASURING TESTING