Minoru Sugiura

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Film-like adhesive, adhesive sheet, and semiconductor device using...
- Patent number 8,293,847
- Issue date Oct 23, 2012
- Hitachi Chemical Co., Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin paste for die bonding, containing a polyurethaneimide resin a...
- Patent number 8,212,370
- Issue date Jul 3, 2012
- Hitachi Chemical Company, Ltd.
- Syuichi Mori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive polyimide precursor and its use for pattern formation
- Patent number 6,319,656
- Issue date Nov 20, 2001
- Hitachi Chemical Company, Ltd.
- Haruhiko Kikkawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitve polymide precursor and its use for pattern formation
- Patent number 6,025,113
- Issue date Feb 15, 2000
- Hitachi Chemical Company, Ltd.
- Haruhiko Kikkawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING...
- Publication number 20100239858
- Publication date Sep 23, 2010
- Takashi Masuko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN PASTE FOR DIE BONDING, METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20100155969
- Publication date Jun 24, 2010
- Syuichi Mori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive polyimide precursor and its use for pattern formation
- Publication number 20020048726
- Publication date Apr 25, 2002
- Hitachi Chemical Company, Ltd.
- Haruhiko Kikkawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...