TREA

Minoru Torihata

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  • Musashimurayama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    XY table for a semiconductor manufacturing apparatus
    • Patent number 6,727,666
    • Issue date Apr 27, 2004
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding capillary
    • Patent number 6,325,269
    • Issue date Dec 4, 2001
    • Toto Ltd.
    • Takesi Suzuki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Guide rail mechanism for a bonding apparatus
    • Patent number 6,145,651
    • Issue date Nov 14, 2000
    • Kabushiki Kaisha Shinkawa
    • Minoru Torihata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Guide rail mechanism for a bonding apparatus
    • Patent number 6,135,270
    • Issue date Oct 24, 2000
    • Kabushiki Kaisha Shinkawa
    • Minoru Torihata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire cutting and feeding device for use in wire bonding apparatus
    • Patent number 6,089,439
    • Issue date Jul 18, 2000
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,036,080
    • Issue date Mar 14, 2000
    • Kabushiki Kaisha Shinkawa
    • Kuniyuki Takahashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,024,271
    • Issue date Feb 15, 2000
    • Kabushiki Kaisha Shinkawa
    • Minoru Torihata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus with adjustable heating blocks, clamps, and rails
    • Patent number 5,988,481
    • Issue date Nov 23, 1999
    • Kabushiki Kaisha Shinkawa
    • Minoru Torihata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Capillary for use in a wire bonding apparatus
    • Patent number 5,906,308
    • Issue date May 25, 1999
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Capillary for a wire bonding apparatus
    • Patent number 5,884,830
    • Issue date Mar 23, 1999
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Clamping device
    • Patent number 5,746,422
    • Issue date May 5, 1998
    • Kabushiki Kaisha Shinkawa
    • Koichi Harada
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 5,564,616
    • Issue date Oct 15, 1996
    • Kabushiki Kaisha Shinkawa
    • Minoru Torihata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Non-contact type moving table
    • Patent number 5,562,395
    • Issue date Oct 8, 1996
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Non-contact type moving table
    • Patent number 5,562,396
    • Issue date Oct 8, 1996
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Non-contact type moving table
    • Patent number 5,501,569
    • Issue date Mar 26, 1996
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Non-contact type moving table
    • Patent number 5,439,341
    • Issue date Aug 8, 1995
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire clampers
    • Patent number 5,435,477
    • Issue date Jul 25, 1995
    • Kabushiki Kaisha Shinkawa
    • Minoru Torihata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Non-contact type moving table system
    • Patent number 5,431,527
    • Issue date Jul 11, 1995
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 5,340,010
    • Issue date Aug 23, 1994
    • Kabushiki Kaisha Shinkawa
    • Minoru Torihata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire clamper
    • Patent number 5,323,948
    • Issue date Jun 28, 1994
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 5,275,324
    • Issue date Jan 4, 1994
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Pushing device
    • Patent number 5,261,777
    • Issue date Nov 16, 1993
    • Kabushiki Kaisha Shinkawa
    • Minoru Torihata
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,259,548
    • Issue date Nov 9, 1993
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 5,234,155
    • Issue date Aug 10, 1993
    • Kabushiki Kaisha Shinkawa
    • Kuniyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    X-Y table for bonding devices
    • Patent number 5,157,985
    • Issue date Oct 27, 1992
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Device for detecting height of bonding surface
    • Patent number 5,046,655
    • Issue date Sep 10, 1991
    • Kabushiki Kaisha Shinkawa
    • Yuji Ohashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents