Minoru Uda

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Nagoya-Shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Material including beryllium intermetallic compound and having exce...
- Patent number 7,560,069
- Issue date Jul 14, 2009
- NGK Insulators, Ltd.
- Hiroshi Kawamura
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Bonded body comprising beryllium member and copper or copper alloy...
- Patent number 6,824,888
- Issue date Nov 30, 2004
- NGK Insulators, Ltd.
- Toshihisa Hatano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Material including beryllium intermetallic compound and having exce...
- Publication number 20050135960
- Publication date Jun 23, 2005
- NGK Insulators, Ltd.
- Hiroshi Kawamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Bonded body comprising beryllium member and copper or copper alloy...
- Publication number 20030085260
- Publication date May 8, 2003
- Toshihisa Hatano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR