Minseung Yoon

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,142,573
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 11,784,131
- Issue date Oct 10, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,196,505
- Issue date Nov 24, 2015
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 8,450,856
- Issue date May 28, 2013
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via structures including conductive protective layers
- Patent number 8,026,592
- Issue date Sep 27, 2011
- Samsung Electronics Co., Ltd.
- Minseung Yoon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240006328
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Yukyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230111854
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220301958
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- SUNGWOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210391269
- Publication date Dec 16, 2021
- Samsung Electronics Co., Ltd.
- Yukyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20130260551
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20120153498
- Publication date Jun 21, 2012
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME
- Publication number 20120049349
- Publication date Mar 1, 2012
- Samsung Electronics Co., Ltd.
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCT...
- Publication number 20110318917
- Publication date Dec 29, 2011
- Minseung Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCTIVE PROTECTIVE LAYE...
- Publication number 20100038800
- Publication date Feb 18, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Minseung Yoon
- H01 - BASIC ELECTRIC ELEMENTS

Minseung Yoon

Person

Patents Grantslast 30 patents

Interposer and semiconductor package including the same

Interposer and semiconductor package including the same

Semiconductor device and method of forming the same

Semiconductor device and method of forming the same

Through-silicon via structures including conductive protective layers

Patents Applicationslast 30 patents

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Semiconductor Device and Method of Forming the Same

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME

METHODS OF FORMING THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCT...

THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCTIVE PROTECTIVE LAYE...