Minto Zheng

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Shenzhen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Staggered dual-side multi-chip interconnect
- Patent number 11,798,923
- Issue date Oct 24, 2023
- NVIDIA Corp.
- Shuo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly
- Patent number 11,616,019
- Issue date Mar 28, 2023
- NVIDIA Corp.
- Jacky Qiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STAGGERED DUAL-SIDE MULTI-CHIP INTERCONNECT
- Publication number 20230411365
- Publication date Dec 21, 2023
- NVIDIA Corp.
- Shuo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Staggered Dual-Side Multi-Chip Interconnect
- Publication number 20230197696
- Publication date Jun 22, 2023
- NVIDIA Corp.
- Shuo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly
- Publication number 20220199528
- Publication date Jun 23, 2022
- NVIDIA Corp.
- Jacky Qiu
- H01 - BASIC ELECTRIC ELEMENTS