Minwoo Rhee

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate transfer apparatus
- Patent number 12,112,970
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Daeho Min
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
3D printing apparatus and 3D printing method
- Patent number 12,070,903
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jungwoo Cho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,581,188
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250233048
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK FOR WAFER BONDING DEVICE
- Publication number 20250219011
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Kyungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING APPARATUS
- Publication number 20250201602
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sunwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PHOTORESIST APPLICATION METHOD AND SEMICONDUCTOR PACKAGE...
- Publication number 20250180994
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Juhyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME
- Publication number 20250140588
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250070079
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- YongChul SHIN
- B32 - LAYERED PRODUCTS
Information Patent Application
WARPAGE CONTROL
- Publication number 20250054878
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Sujie Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTING APPARATUS AND 3D PRINTING METHOD
- Publication number 20240367376
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Jungwoo Cho
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321805
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seungho Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMI...
- Publication number 20240282604
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Sunwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20240186282
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240170445
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240145416
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Wonyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONTACT TYPE GRIPPER
- Publication number 20240139972
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Daeho Min
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
DIE ALIGNMENT METHOD USING MAGNETIC FORCE
- Publication number 20230178280
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Sumin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230178511
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Young Chul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTING APPARATUS AND 3D PRINTING METHOD
- Publication number 20230138834
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Jungwoo Cho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SUBSTRATE TRANSFER APPARATUS
- Publication number 20230113869
- Publication date Apr 13, 2023
- SAMSUNG ELECTRONICS., LTD.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER APPARATUS
- Publication number 20220172977
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- DAEHO MIN
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20210104405
- Publication date Apr 8, 2021
- KNU-INDUSTRY COOPERATION FOUNDATION
- Junhyung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Minwoo Rhee

Person

Patents Grantslast 30 patents

Substrate transfer apparatus

3D printing apparatus and 3D printing method

Substrate bonding apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CHUCK FOR WAFER BONDING DEVICE

HYBRID BONDING APPARATUS

SELECTIVE PHOTORESIST APPLICATION METHOD AND SEMICONDUCTOR PACKAGE...

DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

WARPAGE CONTROL

3D PRINTING APPARATUS AND 3D PRINTING METHOD

WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMI...

DIE BONDING APPARATUS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SUBSTRATE BONDING METHOD

NON-CONTACT TYPE GRIPPER

DIE ALIGNMENT METHOD USING MAGNETIC FORCE

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

3D PRINTING APPARATUS AND 3D PRINTING METHOD

SUBSTRATE TRANSFER APPARATUS

SUBSTRATE TRANSFER APPARATUS

SUBSTRATE BONDING APPARATUS