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MinWook Yu
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Gyeonggi-do, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming thermal interface materi...
Patent number
9,281,228
Issue date
Mar 8, 2016
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with warpage preventing mechani...
Patent number
8,703,535
Issue date
Apr 22, 2014
Stats Chippac Ltd.
MinJung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with heat conduction and method...
Patent number
8,679,900
Issue date
Mar 25, 2014
Stats Chippac Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE PREVENTING MECHANI...
Publication number
20130328179
Publication date
Dec 12, 2013
MinJung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT CONDUCTION AND METHOD...
Publication number
20130154085
Publication date
Jun 20, 2013
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Thermal Interface Materi...
Publication number
20130105963
Publication date
May 2, 2013
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming TIM Within Recesses of M...
Publication number
20130049188
Publication date
Feb 28, 2013
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS