Miriam R. Reshotko

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dielectric gate stack for crystalline thin film transistors
- Patent number 12,009,433
- Issue date Jun 11, 2024
- Intel Corporation
- Van H. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grating replication using helmets and topographically-selective dep...
- Patent number 11,894,270
- Issue date Feb 6, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical architecture of thin film transistors
- Patent number 11,843,054
- Issue date Dec 12, 2023
- Intel Corporation
- Van H. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cladded metal interconnects
- Patent number 11,749,560
- Issue date Sep 5, 2023
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Staggered lines for interconnect performance improvement and proces...
- Patent number 11,664,305
- Issue date May 30, 2023
- Intel Corporation
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helmet structures for semiconductor interconnects
- Patent number 11,646,266
- Issue date May 9, 2023
- Intel Corporation
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maskless air gap enabled by a single damascene process
- Patent number 11,610,810
- Issue date Mar 21, 2023
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact electrodes for vertical thin-film transistors
- Patent number 11,527,656
- Issue date Dec 13, 2022
- Intel Corporation
- Van H. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 11,444,024
- Issue date Sep 13, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact stacks to reduce hydrogen in thin film transistor
- Patent number 11,444,205
- Issue date Sep 13, 2022
- Intel Corporatiion
- Arnab Sen Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire thin film transistors with textured semiconductors
- Patent number 11,417,775
- Issue date Aug 16, 2022
- Intel Corporation
- Shriram Shivaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grating replication using helmets and topographically-selective dep...
- Patent number 11,335,598
- Issue date May 17, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antifuse memory arrays with antifuse elements at the back-end-of-li...
- Patent number 11,264,317
- Issue date Mar 1, 2022
- Intel Corporation
- Vincent Dorgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with airgaps to control capacitance
- Patent number 10,665,499
- Issue date May 26, 2020
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of planar light-wave circuits (PLCS) for optical I/O
- Patent number 9,182,544
- Issue date Nov 10, 2015
- Intel Corporation
- Mauro J. Kobrinsky
- G02 - OPTICS
Information Patent Grant
Waveguide integration on laser for alignment-tolerant assembly
- Patent number 8,731,346
- Issue date May 20, 2014
- Intel Corporation
- Jia-Hung Tseng
- G02 - OPTICS
Information Patent Grant
Waveguide photodetector device and manufacturing method thereof
- Patent number 8,290,325
- Issue date Oct 16, 2012
- Intel Corporation
- Miriam R. Reshotko
- G02 - OPTICS
Information Patent Grant
Dual seed semiconductor photodetectors
- Patent number 7,948,010
- Issue date May 24, 2011
- Intel Corporation
- Miriam Reshotko
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Schottky barrier metal-germanium contact in metal-germanium-metal p...
- Patent number 7,700,975
- Issue date Apr 20, 2010
- Intel Corporation
- Titash Rakshit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive device
- Patent number 7,692,258
- Issue date Apr 6, 2010
- Intel Corporation
- Miriam R. Reshotko
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Dual seed semiconductor photodetectors
- Patent number 7,553,687
- Issue date Jun 30, 2009
- Intel Corporation
- Miriam Reshotko
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Photosensitive device
- Patent number 7,084,471
- Issue date Aug 1, 2006
- Intel Corporation
- Miriam R. Reshotko
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Photosensitive device
- Patent number 6,903,432
- Issue date Jun 7, 2005
- Intel Corporation
- Miriam R. Reshotko
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Current probe device having an integrated amplifier
- Patent number 6,856,129
- Issue date Feb 15, 2005
- Intel Corporation
- Thomas P. Thomas
- G01 - MEASURING TESTING
Information Patent Grant
Integrated photodevice and waveguide
- Patent number 6,813,431
- Issue date Nov 2, 2004
- Intel Corporation
- Paul Davids
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES...
- Publication number 20240170394
- Publication date May 23, 2024
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED STAGGERED INTEGRATED CIRCUIT INTERCONNECT FEATURES
- Publication number 20230395506
- Publication date Dec 7, 2023
- Intel Corporation
- Miriam Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERALLY RECESSED GATE ELECTRODE IN THIN FILM TRANSISTORS
- Publication number 20230369506
- Publication date Nov 16, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER MEMORY STRUCTURE WITH GRADED CHARACTERISTICS
- Publication number 20230371233
- Publication date Nov 16, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAPS USED IN BACKEND MEMORY STRUCTURES
- Publication number 20230307352
- Publication date Sep 28, 2023
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGGERED VERTICALLY SPACED INTEGRATED CIRCUIT LINE METALLIZATION W...
- Publication number 20230197602
- Publication date Jun 22, 2023
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL OF VIAS IN SINGLE AND DUAL DAMASCENE STRUCTURES USING SELF-ASS...
- Publication number 20230197601
- Publication date Jun 22, 2023
- Intel Corporation
- Jiun-Ruey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKEND MEMORY WITH AIR GAPS IN UPPER METAL LAYERS
- Publication number 20220406782
- Publication date Dec 22, 2022
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220352068
- Publication date Nov 3, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRATING REPLICATION USING HELMETS AND TOPOGRAPHICALLY-SELECTIVE DEP...
- Publication number 20220238376
- Publication date Jul 28, 2022
- Intel Corporation
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220139823
- Publication date May 5, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH AREA SELECTIVE ADHESION OR BARRIER MAT...
- Publication number 20220139772
- Publication date May 5, 2022
- Intel Corporation
- Christoper Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE INTERCONNECT STRUCTURES WITH LOW RESISTANCE VIAS FOR INTE...
- Publication number 20220102268
- Publication date Mar 31, 2022
- Intel Corporation
- Urusa Alaan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELMET STRUCTURES FOR SEMICONDUCTOR INTERCONNECTS
- Publication number 20210043565
- Publication date Feb 11, 2021
- Intel Corporation
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGGERED LINES FOR INTERCONNECT PERFORMANCE IMPROVEMENT AND PROCES...
- Publication number 20200411427
- Publication date Dec 31, 2020
- Intel Corporation
- Kevin Lai LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS FOR THIN FILM TRANSISTORS
- Publication number 20200227568
- Publication date Jul 16, 2020
- Intel Corporation
- Van H. LE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS AIR GAP ENABLED BY A SINGLE DAMASCENE PROCESS
- Publication number 20200203212
- Publication date Jun 25, 2020
- Intel Corporation
- Miriam R. RESHOTKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLADDED METAL INTERCONNECTS
- Publication number 20200098619
- Publication date Mar 26, 2020
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT STACKS TO REDUCE HYDROGEN IN THIN FILM TRANSISTOR
- Publication number 20200098657
- Publication date Mar 26, 2020
- Arnab SEN GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ELECTRODES FOR VERTICAL THIN-FILM TRANSISTORS
- Publication number 20200098930
- Publication date Mar 26, 2020
- Van H. LE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE THIN FILM TRANSISTORS WITH TEXTURED SEMICONDUCTORS
- Publication number 20200035839
- Publication date Jan 30, 2020
- Intel Corporation
- Shriram Shivaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES FOR THIN FILM TRANSISTOR DEVICES
- Publication number 20200006570
- Publication date Jan 2, 2020
- Intel Corporation
- Van H. LE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Airgaps to Control Capacitance
- Publication number 20200006115
- Publication date Jan 2, 2020
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRATING REPLICATION USING HELMETS AND TOPOGRAPHICALLY-SELECTIVE DEP...
- Publication number 20200006138
- Publication date Jan 2, 2020
- Intel Corporation
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL ARCHITECTURE OF THIN FILM TRANSISTORS
- Publication number 20190393356
- Publication date Dec 26, 2019
- Intel Corporation
- Van H. LE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIELECTRIC GATE STACK FOR CRYSTALLINE THIN FILM TRANSISTORS
- Publication number 20190378932
- Publication date Dec 12, 2019
- Intel Corporation
- Van H. LE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTIFUSE MEMORY ARRAYS WITH ANTIFUSE ELEMENTS AT THE BACK-END-OF-LI...
- Publication number 20190304894
- Publication date Oct 3, 2019
- Intel Corporation
- Vincent DORGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLING STRUCTURES AND METHODS FOR PHOTONIC DEVICES EMPLOYING ELECTR...
- Publication number 20140086523
- Publication date Mar 27, 2014
- Bruce A. BLOCK
- G02 - OPTICS
Information Patent Application
WAVEGUIDE INTEGRATION ON LASER FOR ALIGNMENT-TOLERANT ASSEMBLY
- Publication number 20140003765
- Publication date Jan 2, 2014
- Jia-Hung Tseng
- G02 - OPTICS

Miriam R. Reshotko

Person

Patents Grantslast 30 patents

Subtractively patterned interconnect structures for integrated circ...

Multi-dielectric gate stack for crystalline thin film transistors

Grating replication using helmets and topographically-selective dep...

Vertical architecture of thin film transistors

Cladded metal interconnects

Staggered lines for interconnect performance improvement and proces...

Helmet structures for semiconductor interconnects

Maskless air gap enabled by a single damascene process

Contact electrodes for vertical thin-film transistors

Subtractively patterned interconnect structures for integrated circ...

Contact stacks to reduce hydrogen in thin film transistor

Nanowire thin film transistors with textured semiconductors

Grating replication using helmets and topographically-selective dep...

Antifuse memory arrays with antifuse elements at the back-end-of-li...

Integrated circuit with airgaps to control capacitance

Fabrication of planar light-wave circuits (PLCS) for optical I/O

Waveguide integration on laser for alignment-tolerant assembly

Waveguide photodetector device and manufacturing method thereof

Dual seed semiconductor photodetectors

Schottky barrier metal-germanium contact in metal-germanium-metal p...

Photosensitive device

Dual seed semiconductor photodetectors

Photosensitive device

Photosensitive device

Current probe device having an integrated amplifier

Integrated photodevice and waveguide

Patents Applicationslast 30 patents

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES...

SELF-ALIGNED STAGGERED INTEGRATED CIRCUIT INTERCONNECT FEATURES

LATERALLY RECESSED GATE ELECTRODE IN THIN FILM TRANSISTORS

MULTI-TIER MEMORY STRUCTURE WITH GRADED CHARACTERISTICS

AIRGAPS USED IN BACKEND MEMORY STRUCTURES

STAGGERED VERTICALLY SPACED INTEGRATED CIRCUIT LINE METALLIZATION W...

FILL OF VIAS IN SINGLE AND DUAL DAMASCENE STRUCTURES USING SELF-ASS...

BACKEND MEMORY WITH AIR GAPS IN UPPER METAL LAYERS

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

GRATING REPLICATION USING HELMETS AND TOPOGRAPHICALLY-SELECTIVE DEP...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

INTERCONNECT STRUCTURES WITH AREA SELECTIVE ADHESION OR BARRIER MAT...

DAMASCENE INTERCONNECT STRUCTURES WITH LOW RESISTANCE VIAS FOR INTE...

HELMET STRUCTURES FOR SEMICONDUCTOR INTERCONNECTS

STAGGERED LINES FOR INTERCONNECT PERFORMANCE IMPROVEMENT AND PROCES...

SELF-ALIGNED CONTACTS FOR THIN FILM TRANSISTORS

MASKLESS AIR GAP ENABLED BY A SINGLE DAMASCENE PROCESS

CLADDED METAL INTERCONNECTS

CONTACT STACKS TO REDUCE HYDROGEN IN THIN FILM TRANSISTOR

CONTACT ELECTRODES FOR VERTICAL THIN-FILM TRANSISTORS

NANOWIRE THIN FILM TRANSISTORS WITH TEXTURED SEMICONDUCTORS

CONTACT STRUCTURES FOR THIN FILM TRANSISTOR DEVICES

Integrated Circuit with Airgaps to Control Capacitance

GRATING REPLICATION USING HELMETS AND TOPOGRAPHICALLY-SELECTIVE DEP...

VERTICAL ARCHITECTURE OF THIN FILM TRANSISTORS

MULTI-DIELECTRIC GATE STACK FOR CRYSTALLINE THIN FILM TRANSISTORS

ANTIFUSE MEMORY ARRAYS WITH ANTIFUSE ELEMENTS AT THE BACK-END-OF-LI...

POLING STRUCTURES AND METHODS FOR PHOTONIC DEVICES EMPLOYING ELECTR...

WAVEGUIDE INTEGRATION ON LASER FOR ALIGNMENT-TOLERANT ASSEMBLY