Mirng-Ji Lii

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Process for tuning via profile in dielectric material
- Patent number 12,136,644
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure with zigzag patterns and method forming same
- Patent number 12,087,648
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,068,303
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 12,062,586
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming semiconducto...
- Patent number 12,051,632
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages including multiple encapsulated substrate blocks and overl...
- Patent number 12,027,435
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,021,048
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die
- Patent number 12,009,327
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures in semiconductor packaged device and method of f...
- Patent number 11,990,428
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with cavity substrate
- Patent number 11,967,579
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,944
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive pad
- Patent number 11,942,445
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,818
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,901,266
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous bonding structure and method forming same
- Patent number 11,894,241
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous bonding structure and method forming same
- Patent number 11,854,835
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,855,058
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a reconstructed package substrate comprising sub...
- Patent number 11,842,935
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,812,646
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yu Wu
Information Patent Grant
Programmable inductor
- Patent number 11,756,731
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structures and methods of forming
- Patent number 11,742,204
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure and method of forming same
- Patent number 11,728,217
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with stacked dies and methods of forming the same
- Patent number 11,652,086
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 11,631,621
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming bonding structures by using template layer as templates
- Patent number 11,594,484
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,569,419
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,532,583
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for tuning via profile in dielectric material
- Patent number 11,532,692
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Structures with Compact Copper Conductive Features
- Publication number 20240387604
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379584
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR TUNING VIA PROFILE IN DIELECTRIC MATERIAL
- Publication number 20240371915
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure with Zigzag Patterns and Method Forming Same
- Publication number 20240363457
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240355692
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332230
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS
- Publication number 20240321661
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE
- Publication number 20240297137
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...
- Publication number 20240266304
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH CAVITY SUBSTRATE
- Publication number 20240234368
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234637
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240153849
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20240145379
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Defect Inspection System and Method
- Publication number 20240125713
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chun Yang
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240128231
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME
- Publication number 20240096647
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240088119
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240038752
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE INDUCTOR AND METHODS OF MANUFACTURE
- Publication number 20230368972
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufactoring Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Structures and Methods of Forming
- Publication number 20230369049
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING VIA CONFIGURATION FOR ADVANCED SILICON NODE PRODUCTS AND M...
- Publication number 20230361022
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chien Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIMCAP CORNER STRUCTURES IN THE KEEP-OUT ZONES OF A SEMICONDUCTOR D...
- Publication number 20230317641
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Kun LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230253273
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mill-Jer WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Stacked Dies and Methods of Forming the Same
- Publication number 20230253369
- Publication date Aug 10, 2023
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230170443
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY MICROBUMP ARRAYS WITH ENHANCED ADHESION AND METHODS OF...
- Publication number 20230107847
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Kun LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Tuning Via Profile in Dielectric Material
- Publication number 20230107187
- Publication date Apr 6, 2023
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure with Zigzag Patterns and Method Forming Same
- Publication number 20230066360
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230062138
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao TSAI
- H01 - BASIC ELECTRIC ELEMENTS

Mirng-Ji Lii

Person

Patents Grantslast 30 patents

Process for tuning via profile in dielectric material

Seal ring structure with zigzag patterns and method forming same

Package structure

Semiconductor device structure with magnetic element

Semiconductor package structure and method for forming semiconducto...

Packages including multiple encapsulated substrate blocks and overl...

Semiconductor device

Semiconductor die

Bonding structures in semiconductor packaged device and method of f...

Method for forming package structure with cavity substrate

Semiconductor device and manufacturing method thereof

Semiconductor device with conductive pad

Semiconductor device

Semiconductor device structure and method for forming the same

Heterogeneous bonding structure and method forming same

Heterogeneous bonding structure and method forming same

Package structure and method of forming the same

Chip structure and method for forming the same

Method for forming a reconstructed package substrate comprising sub...

Connector structure and method of forming same

Display device and manufacturing method thereof

Programmable inductor

Multi-layer structures and methods of forming

Wafer level package structure and method of forming same

Packages with stacked dies and methods of forming the same

Semiconductor device structure with magnetic element

Forming bonding structures by using template layer as templates

Semiconductor device and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Process for tuning via profile in dielectric material

Patents Applicationslast 30 patents

Semiconductor Structures with Compact Copper Conductive Features

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

PROCESS FOR TUNING VIA PROFILE IN DIELECTRIC MATERIAL

Seal Ring Structure with Zigzag Patterns and Method Forming Same

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS

SEMICONDUCTOR DIE

BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...

PACKAGE STRUCTURE WITH CAVITY SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

STACKED VIA STRUCTURES AND METHODS FOR FORMING THE SAME

Defect Inspection System and Method

Semiconductor Devices and Methods of Manufacture

CHIP STRUCTURE

HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

PROGRAMMABLE INDUCTOR AND METHODS OF MANUFACTURE

Multi-Layer Structures and Methods of Forming

STACKING VIA CONFIGURATION FOR ADVANCED SILICON NODE PRODUCTS AND M...

MIMCAP CORNER STRUCTURES IN THE KEEP-OUT ZONES OF A SEMICONDUCTOR D...

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

Packages with Stacked Dies and Methods of Forming the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HIGH-DENSITY MICROBUMP ARRAYS WITH ENHANCED ADHESION AND METHODS OF...

Process for Tuning Via Profile in Dielectric Material

Seal Ring Structure with Zigzag Patterns and Method Forming Same

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME