Mitchell Ong

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for forming wire bonds
- Patent number 8,444,044
- Issue date May 21, 2013
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR FORMING WIRE BONDS
- Publication number 20090223937
- Publication date Sep 10, 2009
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR