Mitsuaki FUSUMADA

Person

Yuki-shi, Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sheet for thermal bonding and sheet for thermal bonding with affixe...
- Patent number 10,301,509
- Issue date May 28, 2019
- Nitto Denko Corporation
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition and electronic component device
- Patent number 9,796,828
- Issue date Oct 24, 2017
- Hitachi Chemical Company, Ltd.
- Yuta Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation
- Patent number 8,729,715
- Issue date May 20, 2014
- Nitto Denko Corporation
- Tomohito Iwashige
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 8,298,872
- Issue date Oct 30, 2012
- Nitto Denko Corporation
- Takashi Oda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and semiconductor device obtained w...
- Patent number 6,916,538
- Issue date Jul 12, 2005
- Nitto Denko Corporation
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and semiconductor device using the...
- Patent number 6,617,046
- Issue date Sep 9, 2003
- Nitto Denko Corporation
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SHEET FOR THERMAL BONDING AND SHEET FOR THERMAL BONDING WITH AFFIXE...
- Publication number 20170369744
- Publication date Dec 28, 2017
- NITTO DENKO CORPORATION
- Yuki Sugo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
- Publication number 20160177055
- Publication date Jun 23, 2016
- Hitachi Chemical Company, Ltd.
- Yuta ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ELECTRONIC PARTS ENCAPSULATION AND ELEC...
- Publication number 20130148304
- Publication date Jun 13, 2013
- Nitto Denko Corporation
- Yuya KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...
- Publication number 20130026662
- Publication date Jan 31, 2013
- Nitto Denko Corporation
- Tomohito IWASHIGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...
- Publication number 20120153512
- Publication date Jun 21, 2012
- Nitto Denko Corporation
- Naoya SUGIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120115281
- Publication date May 10, 2012
- Nitto Denko Corporation
- Tomohito Iwashige
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20110143501
- Publication date Jun 16, 2011
- Nitto Denko Corporation
- Takashi ODA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...
- Publication number 20090281225
- Publication date Nov 12, 2009
- Nitto Denko Corporation
- Takuya ETO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition and semiconductor device obtained w...
- Publication number 20030219619
- Publication date Nov 27, 2003
- NITTO DENKO CORPORATION
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition and semiconductor device using the...
- Publication number 20020151106
- Publication date Oct 17, 2002
- Hiroshi Noro
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuaki FUSUMADA

Person

Patents Grantslast 30 patents

Sheet for thermal bonding and sheet for thermal bonding with affixe...

Epoxy resin composition and electronic component device

Epoxy resin composition for semiconductor encapsulation

Manufacturing method for semiconductor device

Thermosetting resin composition and semiconductor device obtained w...

Thermosetting resin composition and semiconductor device using the...

Patents Applicationslast 30 patents

SHEET FOR THERMAL BONDING AND SHEET FOR THERMAL BONDING WITH AFFIXE...

EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

EPOXY RESIN COMPOSITION FOR ELECTRONIC PARTS ENCAPSULATION AND ELEC...

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...

Thermosetting resin composition and semiconductor device obtained w...

Thermosetting resin composition and semiconductor device using the...