Mitsuaki Iwashita

Person

Nirasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,276,027
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Katsuhiro Morikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrocaloric effect element, heat transfer device, semiconductor...
- Patent number 12,247,768
- Issue date Mar 11, 2025
- Tokyo Electron Limited
- Koji Akiyama
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Substrate processing method and ionic liquid
- Patent number 12,011,738
- Issue date Jun 18, 2024
- Tokyo Electron Limited
- Takeo Nakano
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for manufacturing a contact pad, method for manufacturing a...
- Patent number 11,171,050
- Issue date Nov 9, 2021
- Tokyo Electron Limited
- Koichi Yatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method of hard mask
- Patent number 11,004,684
- Issue date May 11, 2021
- Tokyo Electron Limited
- Mitsuaki Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method of hard mask, forming apparatus of hard mask and rec...
- Patent number 10,224,202
- Issue date Mar 5, 2019
- Tokyo Electron Limited
- Mitsuaki Iwashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method and recording medium
- Patent number 10,224,208
- Issue date Mar 5, 2019
- Tokyo Electron Limited
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method, substrate processing apparatus, and st...
- Patent number 10,199,240
- Issue date Feb 5, 2019
- TOSHIBA MEMORY CORPORATION
- Hidekazu Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, plating apparatus, and storage medium
- Patent number 10,138,556
- Issue date Nov 27, 2018
- Tokyo Electron Limited
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, plating system and storage medium
- Patent number 10,030,308
- Issue date Jul 24, 2018
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalyst layer forming method, catalyst layer forming system and re...
- Patent number 9,966,306
- Issue date May 8, 2018
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing wiring structure, copper displacement plat...
- Patent number 9,888,585
- Issue date Feb 6, 2018
- Tokyo Electron Limited
- Shoso Shinguhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating method, plating system and storage medium
- Patent number 9,837,308
- Issue date Dec 5, 2017
- Tokyo Electron Limited
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and storage medium
- Patent number 9,777,379
- Issue date Oct 3, 2017
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and storage medium having plating...
- Patent number 9,731,322
- Issue date Aug 15, 2017
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, plating apparatus and storage medium
- Patent number 9,725,810
- Issue date Aug 8, 2017
- Tokyo Electron Limited
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, recording medium and plating system
- Patent number 9,711,363
- Issue date Jul 18, 2017
- Tokyo Electron Limited
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal wiring layer forming method, metal wiring layer forming appar...
- Patent number 9,653,354
- Issue date May 16, 2017
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pre-treatment method for plating and storage medium
- Patent number 9,653,350
- Issue date May 16, 2017
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pre-treatment method of plating, storage medium, and plating system
- Patent number 9,650,717
- Issue date May 16, 2017
- Tokyo Electron Limited
- Kazutoshi Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Supercritical drying method for semiconductor substrate and supercr...
- Patent number 9,583,330
- Issue date Feb 28, 2017
- Tokyo Electron Limited
- Linan Ji
- F26 - DRYING
Information Patent Grant
Plating apparatus, plating method, and storage medium
- Patent number 9,552,994
- Issue date Jan 24, 2017
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pre-treatment method for plating and storage medium
- Patent number 9,523,153
- Issue date Dec 20, 2016
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and storage medium
- Patent number 9,505,019
- Issue date Nov 29, 2016
- Toyko Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and storage medium
- Patent number 9,487,865
- Issue date Nov 8, 2016
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and storage medium
- Patent number 9,421,569
- Issue date Aug 23, 2016
- Tokyo Electron Limited
- Takashi Tanaka
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatus for plating process
- Patent number 9,255,331
- Issue date Feb 9, 2016
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus, substrate processing method, and st...
- Patent number 9,236,280
- Issue date Jan 12, 2016
- Tokyo Electron Limited
- Takayuki Toshima
- B08 - CLEANING
Information Patent Grant
Cap metal forming method
- Patent number 8,999,432
- Issue date Apr 7, 2015
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid treatment apparatus and liquid treatment method
- Patent number 8,937,014
- Issue date Jan 20, 2015
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
LIQUID CIRCULATION SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND LIQU...
- Publication number 20240420970
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Takao OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM PROCESSING APPARATUS AND OXIDIZING GAS REMOVAL METHOD
- Publication number 20240087916
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Hirokazu UEDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...
- Publication number 20240060186
- Publication date Feb 22, 2024
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20230230855
- Publication date Jul 20, 2023
- TOKYO ELECTRON LIMITED
- Takeo NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND IONIC LIQUID
- Publication number 20230226571
- Publication date Jul 20, 2023
- TOKYO ELECTRON LIMITED
- Takeo NAKANO
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFAC...
- Publication number 20230223251
- Publication date Jul 13, 2023
- TOKYO ELECTRON LIMITED
- Hirokazu UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCALORIC EFFECT ELEMENT, HEAT TRANSFER DEVICE, SEMICONDUCTOR...
- Publication number 20230135523
- Publication date May 4, 2023
- TOKYO ELECTRON LIMITED
- Koji AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PURIFICATION PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND...
- Publication number 20230111710
- Publication date Apr 13, 2023
- TOKYO ELECTRON LIMITED
- Takeya INOUE
- B08 - CLEANING
Information Patent Application
SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING...
- Publication number 20230055960
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM PROCESSING APPARATUS AND OXIDIZING GAS REMOVAL METHOD
- Publication number 20220403509
- Publication date Dec 22, 2022
- TOKYO ELECTRON LIMITED
- Hirokazu UEDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTATE LIQUID PROCESSING A...
- Publication number 20220344205
- Publication date Oct 27, 2022
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220154342
- Publication date May 19, 2022
- TOKYO ELECTRON LIMITED
- Katsuhiro Morikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220056590
- Publication date Feb 24, 2022
- TOKYO ELECTRON LIMITED
- Satoshi Morita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER WIRING FORMING METHOD AND RECORDING MEDIUM
- Publication number 20210358767
- Publication date Nov 18, 2021
- TOKYO ELECTRON LIMITED
- Takashi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM
- Publication number 20210175079
- Publication date Jun 10, 2021
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER WIRING FORMING METHOD AND RECORDING MEDIUM
- Publication number 20200395243
- Publication date Dec 17, 2020
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A CONTACT PAD, METHOD FOR MANUFACTURING A...
- Publication number 20200035553
- Publication date Jan 30, 2020
- TOKYO ELECTRON LIMITED
- Koichi YATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING METHOD OF HARD MASK
- Publication number 20190157083
- Publication date May 23, 2019
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMING METHOD OF HARD MASK, FORMING APPARATUS OF HARD MASK AND REC...
- Publication number 20170287713
- Publication date Oct 5, 2017
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING APPARATUS, PLATING METHOD AND RECORDING MEDIUM
- Publication number 20170121822
- Publication date May 4, 2017
- TOKYO ELECTRON LIMITED
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND REC...
- Publication number 20170084480
- Publication date Mar 23, 2017
- TOKYO ELECTRON LIMITED
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING METHOD AND RECORDING MEDIUM
- Publication number 20160336179
- Publication date Nov 17, 2016
- TOKYO ELECTRON LIMITED
- Nobutaka Mizutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD, RECORDING MEDIUM AND PLATING SYSTEM
- Publication number 20160307759
- Publication date Oct 20, 2016
- TOKYO ELECTRON LIMITED
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, PLATING METHOD, PLATING SYSTEM AND RECORDING...
- Publication number 20160247765
- Publication date Aug 25, 2016
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATALYST LAYER FORMING METHOD, CATALYST LAYER FORMING SYSTEM AND RE...
- Publication number 20160247683
- Publication date Aug 25, 2016
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL WIRING LAYER FORMING METHOD, METAL WIRING LAYER FORMING APPAR...
- Publication number 20160240436
- Publication date Aug 18, 2016
- TOKYO ELECTRON LIMITED
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING LAYER FORMING METHOD, WIRING LAYER FORMING SYSTEM AND RECORD...
- Publication number 20160190040
- Publication date Jun 30, 2016
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING STRUCTURE, COPPER DISPLACEMENT PLAT...
- Publication number 20160095228
- Publication date Mar 31, 2016
- TOKYO ELECTRON LIMITED
- Shoso Shinguhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CATALYST ADSORPTION METHOD AND CATALYST ADSORPTION DEVICE
- Publication number 20150303103
- Publication date Oct 22, 2015
- TOKYO ELECTRON LIMITED
- Shoso Shinguhara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRE-TREATMENT METHOD OF PLATING, STORAGE MEDIUM, AND PLATING SYSTEM
- Publication number 20150247242
- Publication date Sep 3, 2015
- TOKYO ELECTRON LIMITED
- Kazutoshi Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Mitsuaki Iwashita

Person

Patents Grantslast 30 patents

Substrate processing apparatus and substrate processing method

Electrocaloric effect element, heat transfer device, semiconductor...

Substrate processing method and ionic liquid

Method for manufacturing a contact pad, method for manufacturing a...

Forming method of hard mask

Forming method of hard mask, forming apparatus of hard mask and rec...

Plating method and recording medium

Substrate processing method, substrate processing apparatus, and st...

Plating method, plating apparatus, and storage medium

Plating method, plating system and storage medium

Catalyst layer forming method, catalyst layer forming system and re...

Method for manufacturing wiring structure, copper displacement plat...

Plating method, plating system and storage medium

Plating apparatus, plating method and storage medium

Plating apparatus, plating method and storage medium having plating...

Plating method, plating apparatus and storage medium

Plating method, recording medium and plating system

Metal wiring layer forming method, metal wiring layer forming appar...

Pre-treatment method for plating and storage medium

Pre-treatment method of plating, storage medium, and plating system

Supercritical drying method for semiconductor substrate and supercr...

Plating apparatus, plating method, and storage medium

Pre-treatment method for plating and storage medium

Plating apparatus, plating method and storage medium

Plating apparatus, plating method and storage medium

Plating apparatus, plating method and storage medium

Apparatus for plating process

Substrate processing apparatus, substrate processing method, and st...

Cap metal forming method

Liquid treatment apparatus and liquid treatment method

Patents Applicationslast 30 patents

LIQUID CIRCULATION SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND LIQU...

VACUUM PROCESSING APPARATUS AND OXIDIZING GAS REMOVAL METHOD

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

SUBSTRATE PROCESSING METHOD AND IONIC LIQUID

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFAC...

ELECTROCALORIC EFFECT ELEMENT, HEAT TRANSFER DEVICE, SEMICONDUCTOR...

PURIFICATION PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND...

SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING...

VACUUM PROCESSING APPARATUS AND OXIDIZING GAS REMOVAL METHOD

SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTATE LIQUID PROCESSING A...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

MULTILAYER WIRING FORMING METHOD AND RECORDING MEDIUM

PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM

MULTILAYER WIRING FORMING METHOD AND RECORDING MEDIUM

METHOD FOR MANUFACTURING A CONTACT PAD, METHOD FOR MANUFACTURING A...

FORMING METHOD OF HARD MASK

FORMING METHOD OF HARD MASK, FORMING APPARATUS OF HARD MASK AND REC...

PLATING APPARATUS, PLATING METHOD AND RECORDING MEDIUM

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND REC...

PLATING METHOD AND RECORDING MEDIUM

PLATING METHOD, RECORDING MEDIUM AND PLATING SYSTEM

SEMICONDUCTOR DEVICE, PLATING METHOD, PLATING SYSTEM AND RECORDING...

CATALYST LAYER FORMING METHOD, CATALYST LAYER FORMING SYSTEM AND RE...

METAL WIRING LAYER FORMING METHOD, METAL WIRING LAYER FORMING APPAR...

WIRING LAYER FORMING METHOD, WIRING LAYER FORMING SYSTEM AND RECORD...

METHOD FOR MANUFACTURING WIRING STRUCTURE, COPPER DISPLACEMENT PLAT...

CATALYST ADSORPTION METHOD AND CATALYST ADSORPTION DEVICE

PRE-TREATMENT METHOD OF PLATING, STORAGE MEDIUM, AND PLATING SYSTEM