Mitsugu Shirai

Person

Hadano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laser printing method and apparatus
- Patent number 6,795,105
- Issue date Sep 21, 2004
- Hitachi, Ltd.
- Kaoru Katayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste providing method, soldering method and apparatus and system t...
- Patent number 6,705,505
- Issue date Mar 16, 2004
- Hitachi, Ltd.
- Fumio Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin electronic circuit component and method and apparatus for prod...
- Patent number 6,551,449
- Issue date Apr 22, 2003
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Paste providing method, soldering method and apparatus and system t...
- Patent number 6,533,162
- Issue date Mar 18, 2003
- Hitachi, Ltd.
- Fumio Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing electronic circuit devices
- Patent number 6,471,115
- Issue date Oct 29, 2002
- Hitachi, Ltd.
- Masahito Ijuin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser printing method and apparatus for printing characters
- Patent number 6,433,810
- Issue date Aug 13, 2002
- Hitachi, Ltd.
- Kaoru Katayama
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,410,881
- Issue date Jun 25, 2002
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,269,998
- Issue date Aug 7, 2001
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin electronic circuit component and method and apparatus for prod...
- Patent number 6,203,655
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Paste providing method, soldering method and apparatus and system t...
- Patent number 6,193,144
- Issue date Feb 27, 2001
- Hitachi, Ltd.
- Fumio Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,161,748
- Issue date Dec 19, 2000
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, IC card, and manufacturing method thereof
- Patent number 6,137,687
- Issue date Oct 24, 2000
- Hitachi, Ltd.
- Mitsugu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,133,135
- Issue date Oct 17, 2000
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device bonding method and electronic circuit apparatus
- Patent number 5,973,406
- Issue date Oct 26, 1999
- Hitachi, Ltd.
- Masahide Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 5,940,728
- Issue date Aug 17, 1999
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming conductive bumps
- Patent number 5,551,148
- Issue date Sep 3, 1996
- Hitachi, Ltd.
- Shinichi Kazui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering method and apparatus for use in connecting electronic cir...
- Patent number 5,516,031
- Issue date May 14, 1996
- Hitachi, Ltd.
- Toru Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with metalized portions
- Patent number 5,329,160
- Issue date Jul 12, 1994
- Hitachi, Ltd.
- Shinya Miura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Paste providing method, soldering method and apparatus and system t...
- Publication number 20030057264
- Publication date Mar 27, 2003
- Fumio Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser printing method and apparatus
- Publication number 20020093562
- Publication date Jul 18, 2002
- Hitachi, Ltd.
- Kaoru Katayama
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Thin electronic circuit component and method and apparatus for prod...
- Publication number 20010050138
- Publication date Dec 13, 2001
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Process for manufacturing electronic circuits
- Publication number 20010039725
- Publication date Nov 15, 2001
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Paste providing method, soldering method and apparatus and system t...
- Publication number 20010000906
- Publication date May 10, 2001
- Fumio Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mitsugu Shirai

Person

Patents Grantslast 30 patents

Laser printing method and apparatus

Paste providing method, soldering method and apparatus and system t...

Thin electronic circuit component and method and apparatus for prod...

Paste providing method, soldering method and apparatus and system t...

Process for manufacturing electronic circuit devices

Laser printing method and apparatus for printing characters

Process for manufacturing electronic circuits

Process for manufacturing electronic circuits

Thin electronic circuit component and method and apparatus for prod...

Paste providing method, soldering method and apparatus and system t...

Process for manufacturing electronic circuits

Printed circuit board, IC card, and manufacturing method thereof

Process for manufacturing electronic circuits

Electronic device bonding method and electronic circuit apparatus

Process for manufacturing electronic circuits

Method for forming conductive bumps

Soldering method and apparatus for use in connecting electronic cir...

Semiconductor package with metalized portions

Patents Applicationslast 30 patents

Paste providing method, soldering method and apparatus and system t...

Laser printing method and apparatus

Thin electronic circuit component and method and apparatus for prod...

Process for manufacturing electronic circuits

Paste providing method, soldering method and apparatus and system t...