Mitsuhiro Furukawa

Person

Kadoma-Shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of plasma dicing bulk acoustic wave components
- Patent number 12,143,091
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bulk acoustic wave component with conductor extending laterally fro...
- Patent number 11,811,385
- Issue date Nov 7, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked acoustic wave resonator package with laser-drilled VIAS
- Patent number 11,581,870
- Issue date Feb 14, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic package including cavity formed by removal of sacrificia...
- Patent number 11,545,952
- Issue date Jan 3, 2023
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of plasma dicing bulk acoustic wave components
- Patent number 11,496,111
- Issue date Nov 8, 2022
- Skyworks Solutions, Inc.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk acoustic wave components
- Patent number 11,251,769
- Issue date Feb 15, 2022
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic package including cavity defined by resin and method of...
- Patent number 10,999,932
- Issue date May 4, 2021
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including cavity formed by removal of sacrificia...
- Patent number 10,574,202
- Issue date Feb 25, 2020
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic package including cavity defined by resin and method of...
- Patent number 10,321,572
- Issue date Jun 11, 2019
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device with sealing structure
- Patent number 10,075,146
- Issue date Sep 11, 2018
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Yosuke Hamaoka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave devices
- Patent number 9,503,050
- Issue date Nov 22, 2016
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Yosuke Hamaoka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device with integrated inductor
- Patent number 9,325,295
- Issue date Apr 26, 2016
- SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD
- Hideaki Nakayama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device
- Patent number 9,124,239
- Issue date Sep 1, 2015
- SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD
- Hideaki Nakayama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device having an inorganic insulator and an organic i...
- Patent number 9,099,981
- Issue date Aug 4, 2015
- SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD
- Mitsuhiro Furukawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave element and electronic device including the same
- Patent number 8,564,171
- Issue date Oct 22, 2013
- Panasonic Corporation
- Toru Yamaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device and electronic device using the same
- Patent number 8,471,433
- Issue date Jun 25, 2013
- Panasonic Corporation
- Toru Yamaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device and method for manufacturing the same
- Patent number 7,982,364
- Issue date Jul 19, 2011
- Panasonic Corporation
- Ryouichi Takayama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Under bump metal film comprising a stress relaxation layer and a di...
- Patent number 7,764,007
- Issue date Jul 27, 2010
- Panasonic Corporation
- Mitsuhiro Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package
- Patent number 7,652,214
- Issue date Jan 26, 2010
- Panasonic Corporation
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Actuator, switch using the actuator, and method of controlling the...
- Patent number 7,633,213
- Issue date Dec 15, 2009
- Panasonic Corporation
- Ryouichi Takayama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic component package
- Patent number 7,622,684
- Issue date Nov 24, 2009
- Panasonic Corporation
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave device and electronic component comprising it
- Patent number 7,030,539
- Issue date Apr 18, 2006
- Matsushita Electric Industrial Co., Ltd.
- Mitsuhiro Furukawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing a surface acoustic wave element
- Patent number 6,951,047
- Issue date Oct 4, 2005
- Matsushita Electric Industrial Co., Ltd.
- Muneko Tomioka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Surface acoustic wave device, electronic component using the device...
- Patent number 6,937,114
- Issue date Aug 30, 2005
- Matsushita Electric Industrial Co., Ltd.
- Mitsuhiro Furukawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing surface acoustic wave device
- Patent number 6,855,637
- Issue date Feb 15, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kiyoharu Yamashita
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave filter
- Patent number 6,310,422
- Issue date Oct 30, 2001
- Matsushita Electric Industrial Co., Ltd.
- Yuki Satoh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device and production method thereof and mobi...
- Patent number 6,297,580
- Issue date Oct 2, 2001
- Matsushita Electric Industrial Co., Ltd.
- Ryouichi Takayama
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING BUFFE...
- Publication number 20240097640
- Publication date Mar 21, 2024
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS
- Publication number 20240072758
- Publication date Feb 29, 2024
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR FORMING ACOUSTIC WAVE DEVICE
- Publication number 20230147060
- Publication date May 11, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED FILTER PACKAGE HAVING MULTIPLE TYPES OF ACOUSTIC WAVE DEVICES
- Publication number 20230142089
- Publication date May 11, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING SILIC...
- Publication number 20230115592
- Publication date Apr 13, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SUBSTRATE HAVING A METAL LAYER COMPRISING A MARKING
- Publication number 20230104665
- Publication date Apr 6, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS
- Publication number 20230059917
- Publication date Feb 23, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CAP SUBSTRATE FOR ACOUSTIC WAVE DEVICE
- Publication number 20220337213
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Wilfred Ryan Vidamo Habana
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CAP SUBSTRATE FOR ACOUSTIC WAVE DEVICE
- Publication number 20220337217
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Wilfred Ryan Vidamo Habana
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF MANUFACTURING A SELF-SHIELDED ACOUSTIC WAVE DEVICE PACKAGE
- Publication number 20220321081
- Publication date Oct 6, 2022
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SELF-SHIELDED ACOUSTIC WAVE DEVICE PACKAGE
- Publication number 20220321090
- Publication date Oct 6, 2022
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF MAKING STACKED ACOUSTIC WAVE RESONATOR PACKAGE WITH LASER...
- Publication number 20210152151
- Publication date May 20, 2021
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF MAKING ACOUSTIC WAVE RESONATOR WITH LASER-DRILLED VIAS
- Publication number 20210119608
- Publication date Apr 22, 2021
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE RESONATOR WITH LASER-DRILLED VIAS
- Publication number 20210119607
- Publication date Apr 22, 2021
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED ACOUSTIC WAVE RESONATOR PACKAGE WITH LASER-DRILLED VIAS
- Publication number 20210099157
- Publication date Apr 1, 2021
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC PACKAGE INCLUDING CAVITY FORMED BY REMOVAL OF SACRIFICIA...
- Publication number 20200153407
- Publication date May 14, 2020
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BULK ACOUSTIC WAVE COMPONENTS
- Publication number 20200127633
- Publication date Apr 23, 2020
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS
- Publication number 20200127632
- Publication date Apr 23, 2020
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...
- Publication number 20190246500
- Publication date Aug 8, 2019
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...
- Publication number 20170290160
- Publication date Oct 5, 2017
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE INCLUDING CAVITY FORMED BY REMOVAL OF SACRIFICIA...
- Publication number 20170288627
- Publication date Oct 5, 2017
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELASTIC WAVE DEVICE WITH SEALING STRUCTURE
- Publication number 20170054428
- Publication date Feb 23, 2017
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Yosuke Hamaoka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICES
- Publication number 20160036414
- Publication date Feb 4, 2016
- SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD
- Yosuke Hamaoka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICE WITH INTEGRATED INDUCTOR
- Publication number 20160036416
- Publication date Feb 4, 2016
- SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD
- Hideaki Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC WAVE DEVICE AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20130257221
- Publication date Oct 3, 2013
- PANASONIC CORPORATION
- Toru YAMAJI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICE
- Publication number 20120280768
- Publication date Nov 8, 2012
- PANASONIC CORPORATION
- Hideaki Nakayama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20120279795
- Publication date Nov 8, 2012
- PANASONIC CORPORATION
- Mitsuhiro Furukawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE ELEMENT AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20120086309
- Publication date Apr 12, 2012
- Toru YAMAJI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICE AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20110084573
- Publication date Apr 14, 2011
- Toru YAMAJI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20090194325
- Publication date Aug 6, 2009
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY

Mitsuhiro Furukawa

Person

Patents Grantslast 30 patents

Methods of plasma dicing bulk acoustic wave components

Bulk acoustic wave component with conductor extending laterally fro...

Stacked acoustic wave resonator package with laser-drilled VIAS

Electronic package including cavity formed by removal of sacrificia...

Methods of plasma dicing bulk acoustic wave components

Bulk acoustic wave components

Electronic package including cavity defined by resin and method of...

Electronic package including cavity formed by removal of sacrificia...

Electronic package including cavity defined by resin and method of...

Elastic wave device with sealing structure

Elastic wave devices

Elastic wave device with integrated inductor

Elastic wave device

Acoustic wave device having an inorganic insulator and an organic i...

Acoustic wave element and electronic device including the same

Elastic wave device and electronic device using the same

Surface acoustic wave device and method for manufacturing the same

Under bump metal film comprising a stress relaxation layer and a di...

Electronic component package

Actuator, switch using the actuator, and method of controlling the...

Electronic component package

Surface acoustic wave device and electronic component comprising it

Method of manufacturing a surface acoustic wave element

Surface acoustic wave device, electronic component using the device...

Method for manufacturing surface acoustic wave device

Surface acoustic wave filter

Surface acoustic wave device and production method thereof and mobi...

Patents Applicationslast 30 patents

BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING BUFFE...

METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS

METHOD FOR FORMING ACOUSTIC WAVE DEVICE

STACKED FILTER PACKAGE HAVING MULTIPLE TYPES OF ACOUSTIC WAVE DEVICES

BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING SILIC...

SUBSTRATE HAVING A METAL LAYER COMPRISING A MARKING

METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS

METHOD OF MANUFACTURING A CAP SUBSTRATE FOR ACOUSTIC WAVE DEVICE

CAP SUBSTRATE FOR ACOUSTIC WAVE DEVICE

METHOD OF MANUFACTURING A SELF-SHIELDED ACOUSTIC WAVE DEVICE PACKAGE

SELF-SHIELDED ACOUSTIC WAVE DEVICE PACKAGE

METHOD OF MAKING STACKED ACOUSTIC WAVE RESONATOR PACKAGE WITH LASER...

METHOD OF MAKING ACOUSTIC WAVE RESONATOR WITH LASER-DRILLED VIAS

ACOUSTIC WAVE RESONATOR WITH LASER-DRILLED VIAS

STACKED ACOUSTIC WAVE RESONATOR PACKAGE WITH LASER-DRILLED VIAS

ELECTRONIC PACKAGE INCLUDING CAVITY FORMED BY REMOVAL OF SACRIFICIA...

BULK ACOUSTIC WAVE COMPONENTS

METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS

ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...

ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...

ELECTRONIC PACKAGE INCLUDING CAVITY FORMED BY REMOVAL OF SACRIFICIA...

ELASTIC WAVE DEVICE WITH SEALING STRUCTURE

ELASTIC WAVE DEVICES

ELASTIC WAVE DEVICE WITH INTEGRATED INDUCTOR

ELASTIC WAVE DEVICE AND ELECTRONIC DEVICE USING THE SAME

ELASTIC WAVE DEVICE

ACOUSTIC WAVE DEVICE

ACOUSTIC WAVE ELEMENT AND ELECTRONIC DEVICE INCLUDING THE SAME

ELASTIC WAVE DEVICE AND ELECTRONIC DEVICE USING THE SAME

ELECTRONIC COMPONENT PACKAGE