Mitsuhiro Kondo

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,765,692
- Issue date Aug 3, 2010
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 7,612,295
- Issue date Nov 3, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,594,320
- Issue date Sep 29, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board having a previously...
- Patent number 7,552,531
- Issue date Jun 30, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 7,339,118
- Issue date Mar 4, 2008
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 6,986,917
- Issue date Jan 17, 2006
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 6,825,421
- Issue date Nov 30, 2004
- Ibiden Co., Ltd.
- Masaru Takada
Information Patent Grant
Printed-circuit board and method of manufacture thereof
- Patent number 6,809,415
- Issue date Oct 26, 2004
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having throughole and annular lands
- Patent number 6,590,165
- Issue date Jul 8, 2003
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 6,555,208
- Issue date Apr 29, 2003
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing the same
- Patent number 6,455,783
- Issue date Sep 24, 2002
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 6,284,353
- Issue date Sep 4, 2001
- Ibiden Co., Ltd.
- Masaru Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 6,228,466
- Issue date May 8, 2001
- Ibiden Co. Ltd.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-parts mounting board and electronic-parts mounting board...
- Patent number 5,530,204
- Issue date Jun 25, 1996
- Ibiden Co., Ltd.
- Mitsuhiro Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component carriers and method of producing the same as w...
- Patent number 5,438,478
- Issue date Aug 1, 1995
- Ibiden Co., Ltd.
- Mitsuhiro Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part mounting board and semiconductor device using the same
- Patent number 5,299,097
- Issue date Mar 29, 1994
- Ibiden Co., Ltd.
- Mitsuhiro Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor device with bridge sealed lead frame
- Patent number 5,285,104
- Issue date Feb 8, 1994
- Ibiden Co., Ltd.
- Mitsuhiro Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-parts mounting board and electronic-parts mounting board...
- Patent number 5,274,197
- Issue date Dec 28, 1993
- Ibiden Co., Ltd.
- Mitsuhiro Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-parts mounting board and electronic-parts mounting board...
- Patent number 5,252,784
- Issue date Oct 12, 1993
- Ibiden Co., Ltd.
- Takuji Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a high lead count circuit board
- Patent number 5,206,188
- Issue date Apr 27, 1993
- Ibiden Co., Ltd.
- Atsushi Hiroi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High lead count circuit board for connecting electronic components...
- Patent number 5,151,771
- Issue date Sep 29, 1992
- Ibiden Co., Ltd.
- Atsushi Hiroi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board for mounting electronic components
- Patent number 5,088,008
- Issue date Feb 11, 1992
- Ibiden Co., Ltd.
- Takeshi Takeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board for mounting electronic compo...
- Patent number 5,022,960
- Issue date Jun 11, 1991
- Ibiden Co., Ltd.
- Takeshi Takeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a substrate for mounting electronic components
- Patent number 4,908,933
- Issue date Mar 20, 1990
- Ibiden Co., Ltd.
- Katsumi Sagisaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090019693
- Publication date Jan 22, 2009
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board and Method for Manufacturing The Same
- Publication number 20060202344
- Publication date Sep 14, 2006
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20060042824
- Publication date Mar 2, 2006
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20030203170
- Publication date Oct 30, 2003
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20030150644
- Publication date Aug 14, 2003
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20010038905
- Publication date Nov 8, 2001
- Masaru Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-circuit board and method of manufacture thereof
- Publication number 20010002728
- Publication date Jun 7, 2001
- IBIDEN CO., LTD.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuhiro Kondo

Person

Patents Grantslast 30 patents

Method of manufacturing printed wiring board

Printed wiring board and method for manufacturing the same

Method of manufacturing printed wiring board

Method of manufacturing a printed wiring board having a previously...

Printed wiring board and method for manufacturing the same

Printed wiring board and method of manufacturing the same

Printed wiring board and method for manufacturing the same

Printed-circuit board and method of manufacture thereof

Printed wiring board having throughole and annular lands

Printed wiring board and method of manufacturing the same

Multilayer printed wiring board and method for manufacturing the same

Printed wiring board and method of manufacturing the same

Printed wiring board and method for manufacturing the same

Electronic-parts mounting board and electronic-parts mounting board...

Electronic component carriers and method of producing the same as w...

Electronic part mounting board and semiconductor device using the same

Encapsulated semiconductor device with bridge sealed lead frame

Electronic-parts mounting board and electronic-parts mounting board...

Electronic-parts mounting board and electronic-parts mounting board...

Method of manufacturing a high lead count circuit board

High lead count circuit board for connecting electronic components...

Circuit board for mounting electronic components

Method of manufacturing circuit board for mounting electronic compo...

Method of manufacturing a substrate for mounting electronic components

Patents Applicationslast 30 patents

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Printed Wiring Board and Method for Manufacturing The Same

Printed wiring board and method of manufacturing the same

Printed wiring board and method of manufacturing the same

Printed wiring board and method of manufacturing the same

Printed wiring board and method of manufacturing the same

Printed-circuit board and method of manufacture thereof