Mitsuhiro Nakao

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method
- Patent number 8,308,049
- Issue date Nov 13, 2012
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 8,231,046
- Issue date Jul 31, 2012
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 7,849,897
- Issue date Dec 14, 2010
- Kabushiki Kaisha Toshiba
- Shoko Omizo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Antenna device and radio communication device
- Patent number 7,768,456
- Issue date Aug 3, 2010
- Kabushiki Kaisha Toshiba
- Yukako Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an insulating film and insulating pi...
- Patent number 7,675,183
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device wherein chips are stacked to have a fine pitch...
- Patent number 6,897,552
- Issue date May 24, 2005
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved bonding
- Patent number 6,727,593
- Issue date Apr 27, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with smaller package
- Patent number 5,801,433
- Issue date Sep 1, 1998
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 5,763,849
- Issue date Jun 9, 1998
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with smaller package having leads with alterna...
- Patent number 5,592,020
- Issue date Jan 7, 1997
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR JOINING BONDING WIRE, SEMICONDUCTOR DEVICE, AND METHOD F...
- Publication number 20120193784
- Publication date Aug 2, 2012
- Kabushiki Kaisha Toshiba
- Norihiro Togasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100181367
- Publication date Jul 22, 2010
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD
- Publication number 20100096437
- Publication date Apr 22, 2010
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20080237863
- Publication date Oct 2, 2008
- Kabushiki Kaisha Tosiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna device and radio communication device
- Publication number 20080231518
- Publication date Sep 25, 2008
- Kabushiki Kaisha Toshiba
- Yukako Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for manufacturing semiconductor device
- Publication number 20080110546
- Publication date May 15, 2008
- Shoko Omizo
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20080099532
- Publication date May 1, 2008
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20060113674
- Publication date Jun 1, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20040159951
- Publication date Aug 19, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20030111722
- Publication date Jun 19, 2003
- Mitsuhiro Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20020121703
- Publication date Sep 5, 2002
- KABUSHI KAISHA TOSHIBA
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuhiro Nakao

Person

Patents Grantslast 30 patents

Wire bonding method

Wire bonding apparatus and wire bonding method

Apparatus and method for manufacturing semiconductor device

Antenna device and radio communication device

Semiconductor device including an insulating film and insulating pi...

Semiconductor device wherein chips are stacked to have a fine pitch...

Semiconductor device with improved bonding

Semiconductor device with smaller package

Wire bonding apparatus

Semiconductor device with smaller package having leads with alterna...

Patents Applicationslast 30 patents

METHOD FOR JOINING BONDING WIRE, SEMICONDUCTOR DEVICE, AND METHOD F...

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

BONDING METHOD

Semiconductor device and manufacturing method of semiconductor device

Antenna device and radio communication device

Apparatus and method for manufacturing semiconductor device

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method of fabricating the same

Semiconductor device and manufacturing method of semiconductor device