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Mitsuhiro Takayama
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Gunma-Gun, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Composite multi-layer substrate and module using the substrate
Patent number
RE45146
Issue date
Sep 23, 2014
Taiyo Yuden Co., Ltd.
Masashi Miyazaki
257 - Active solid-state devices
Information
Patent Grant
Composite multi-layer substrate and module using the substrate
Patent number
7,928,560
Issue date
Apr 19, 2011
Taiyo Yuden Co., Ltd.
Masashi Miyazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Composite multi-layer substrate and module using the substrate
Patent number
7,745,926
Issue date
Jun 29, 2010
Taiyo Yuden Co., Ltd.
Masashi Miyazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Composite multi-layer substrate and module using the substrate
Patent number
7,348,662
Issue date
Mar 25, 2008
Taiyo Yuden Co., Ltd.
Masashi Miyazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer printed wiring board and production method therefor
Patent number
7,278,205
Issue date
Oct 9, 2007
Taiyo Yuden Co., Ltd.
Masashi Miyazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
COMPOSITE MULTI-LAYER SUBSTRATE AND MODULE USING THE SUBSTRATE
Publication number
20100300736
Publication date
Dec 2, 2010
Taiyo Yuden Co., Ltd.
Masashi Miyazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Composite multi-layer substrate and module using the substrate
Publication number
20080006928
Publication date
Jan 10, 2008
Taiyo Yuden Co., Ltd.
Masashi Miyazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer printed wiring board and production method therefor
Publication number
20070029109
Publication date
Feb 8, 2007
Masashi Miyazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Composite multi-layer substrate and module using the substrate
Publication number
20060255440
Publication date
Nov 16, 2006
Taiyo Yuden Co., Ltd.
Masashi Miyazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer printed wiring board and production method therefor
Publication number
20060016620
Publication date
Jan 26, 2006
Masashi Miyazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR