Mitsuhiro Tomikawa

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 10,143,092
- Issue date Nov 27, 2018
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,955,591
- Issue date Apr 24, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,930,791
- Issue date Mar 27, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,872,401
- Issue date Jan 16, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,831,163
- Issue date Nov 28, 2017
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,743,534
- Issue date Aug 22, 2017
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,433,097
- Issue date Aug 30, 2016
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 9,332,657
- Issue date May 3, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,232,656
- Issue date Jan 5, 2016
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,204,552
- Issue date Dec 1, 2015
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,891,245
- Issue date Nov 18, 2014
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,829,357
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in imaging device and method for manufactur...
- Patent number 8,698,269
- Issue date Apr 15, 2014
- Ibiden Co., Ltd.
- Nobuhiro Hanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,693,209
- Issue date Apr 8, 2014
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160268189
- Publication date Sep 15, 2016
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160242293
- Publication date Aug 18, 2016
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING...
- Publication number 20160143134
- Publication date May 19, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160105957
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160105966
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160021753
- Publication date Jan 21, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160007468
- Publication date Jan 7, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160007451
- Publication date Jan 7, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140153205
- Publication date Jun 5, 2014
- IBIDEN CO., LTD.
- Yukinobu Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20130256007
- Publication date Oct 3, 2013
- IBIDEN CO., LTD.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20130192884
- Publication date Aug 1, 2013
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20130081866
- Publication date Apr 4, 2013
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20130081870
- Publication date Apr 4, 2013
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120287586
- Publication date Nov 15, 2012
- IBIDEN CO., LTD.
- Yukinobu Mikado
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD WITH BUILT-IN IMAGING DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20120217607
- Publication date Aug 30, 2012
- IBIDEN CO., LTD.
- Nobuhiro HANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120186866
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mitsuhiro Tomikawa

Person

Patents Grantslast 30 patents

Circuit substrate and method for manufacturing the same

Circuit substrate and method for manufacturing the same

Wiring board with built-in electronic component and method for manu...

Circuit substrate and method for manufacturing the same

Circuit substrate and method for manufacturing the same

Wiring board with built-in electronic component and method for manu...

Circuit substrate and method for manufacturing the same

Multilayer printed wiring board and method for manufacturing multil...

Wiring board and method for manufacturing the same

Printed wiring board

Printed wiring board

Wiring board and method for manufacturing the same

Wiring board with built-in imaging device and method for manufactur...

Wiring board and method for manufacturing the same

Patents Applicationslast 30 patents

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

PRINTED WIRING BOARD

PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN IMAGING DEVICE AND METHOD FOR MANUFACTUR...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME