Mitsuhisa Watanabe

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device suitable for a stacked structure
- Patent number 8,216,934
- Issue date Jul 10, 2012
- Fujitsu Semiconductor Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device suitable for a stacked structure
- Patent number 7,884,459
- Issue date Feb 8, 2011
- Fujitsu Semiconductor Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum fixing jig for semiconductor device
- Patent number 7,571,538
- Issue date Aug 11, 2009
- Fujitsu Microelectronics Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Jig for a semiconductor substrate
- Patent number 7,395,847
- Issue date Jul 8, 2008
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a semiconductor device and a method for fix...
- Patent number 7,109,561
- Issue date Sep 19, 2006
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making semiconductor device that has improved structural...
- Patent number 6,951,800
- Issue date Oct 4, 2005
- Fujitsu Limited
- Yoshiaki Shinjo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device and a method for fix...
- Patent number 6,902,944
- Issue date Jun 7, 2005
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Recognition method of a mark provided on a semiconductor device
- Patent number 6,869,819
- Issue date Mar 22, 2005
- Fujitsu Limited
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat-object holder and method of using the same
- Patent number 6,837,776
- Issue date Jan 4, 2005
- Fujitsu Limited
- Yuzo Shimobeppu
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a semiconductor device and a method for fix...
- Patent number 6,750,074
- Issue date Jun 15, 2004
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor chip removing and conveying method and device
- Patent number 6,461,942
- Issue date Oct 8, 2002
- Fujitsu Limited
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE
- Publication number 20110092065
- Publication date Apr 21, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Eiji YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE
- Publication number 20090008798
- Publication date Jan 8, 2009
- Fujitsu Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a method for fix...
- Publication number 20050221587
- Publication date Oct 6, 2005
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing a semiconductor device and a method for fix...
- Publication number 20050221589
- Publication date Oct 6, 2005
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing a semiconductor device and a method for fix...
- Publication number 20050221588
- Publication date Oct 6, 2005
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor device, three-dimensional semiconductor device, and m...
- Publication number 20050167812
- Publication date Aug 4, 2005
- FUJITSU LIMITED
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat-object holder and method of using the same
- Publication number 20050085171
- Publication date Apr 21, 2005
- Yuzo Shimobeppu
- B24 - GRINDING POLISHING
Information Patent Application
Method of Manufacturing a Semiconductor Device and a Method for Fix...
- Publication number 20040161882
- Publication date Aug 19, 2004
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Recognition method of a mark provided on a semiconductor device
- Publication number 20030224540
- Publication date Dec 4, 2003
- FUJITSU LIMITED
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making semiconductor device that has improved structural...
- Publication number 20030077880
- Publication date Apr 24, 2003
- FUJITSU LIMITED
- Yoshiaki Shinjo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flat-object holder and method of using the same
- Publication number 20030077993
- Publication date Apr 24, 2003
- Yuzo Shimobeppu
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor substrate jig and method of manufacturing a semicondu...
- Publication number 20030077854
- Publication date Apr 24, 2003
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor chip removing and conveying method and device
- Publication number 20010049160
- Publication date Dec 6, 2001
- FUJITSU LIMITED
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuhisa Watanabe

Person

Patents Grantslast 30 patents

Semiconductor device suitable for a stacked structure

Semiconductor device suitable for a stacked structure

Vacuum fixing jig for semiconductor device

Jig for a semiconductor substrate

Method of manufacturing a semiconductor device and a method for fix...

Method of making semiconductor device that has improved structural...

Method of manufacturing a semiconductor device and a method for fix...

Recognition method of a mark provided on a semiconductor device

Flat-object holder and method of using the same

Method of manufacturing a semiconductor device and a method for fix...

Semiconductor chip removing and conveying method and device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE

SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE

Method of manufacturing a semiconductor device and a method for fix...

Method of manufacturing a semiconductor device and a method for fix...

Method of manufacturing a semiconductor device and a method for fix...

Semiconductor device, three-dimensional semiconductor device, and m...

Flat-object holder and method of using the same

Method of Manufacturing a Semiconductor Device and a Method for Fix...

Recognition method of a mark provided on a semiconductor device

Method of making semiconductor device that has improved structural...

Flat-object holder and method of using the same

Semiconductor substrate jig and method of manufacturing a semicondu...

Semiconductor chip removing and conveying method and device