Mitsuhito KANATAKE

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package, semiconductor package manufacturing method,...
- Patent number 12,310,132
- Issue date May 20, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Mitsuhito Kanatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, imaging apparatus, and method for manufacturi...
- Patent number 11,942,495
- Issue date Mar 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Daisuke Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an optically coupled device
- Patent number 8,288,183
- Issue date Oct 16, 2012
- Renesas Electronics Corporation
- Mitsuhito Kanatake
- G02 - OPTICS
Information Patent Grant
Optically coupled device with an optical waveguide
- Patent number 8,143,637
- Issue date Mar 27, 2012
- Renesas Electronics Corporation
- Mitsuhito Kanatake
- G02 - OPTICS
Information Patent Grant
Semiconductor package having a resin cap member
- Patent number 7,060,530
- Issue date Jun 13, 2006
- NEC Compound Semiconductor Devices, Ltd.
- Mitsuhito Kanatake
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD F...
- Publication number 20250160012
- Publication date May 15, 2025
- Sony Semiconductor Solutions Corporation
- SHINGO HAMAGUCHI
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING SOLID-ST...
- Publication number 20230275108
- Publication date Aug 31, 2023
- Sony Semiconductor Solutions Corporation
- YASUSHI OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD,...
- Publication number 20220254824
- Publication date Aug 11, 2022
- Sony Semiconductor Solutions Corporation
- MITSUHITO KANATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, IMAGING APPARATUS, AND METHOD FOR MANUFACTURI...
- Publication number 20210233949
- Publication date Jul 29, 2021
- Sony Semiconductor Solutions Corporation
- DAISUKE CHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN OPTICALLY COUPLED DEVICE
- Publication number 20120104636
- Publication date May 3, 2012
- RENESAS ELECTRONICS CORPORATION
- Mitsuhito KANATAKE
- G02 - OPTICS
Information Patent Application
OPTICALLY COUPLED DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100171127
- Publication date Jul 8, 2010
- NEC ELECTRONICS CORPORATION
- Mitsuhito KANATAKE
- G02 - OPTICS
Information Patent Application
Multi-channel photocoupling device and producing method thereof
- Publication number 20080042080
- Publication date Feb 21, 2008
- NEC ELECTRONICS CORPORATION
- Mitsuhito Kanatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having a resin cap member
- Publication number 20020190266
- Publication date Dec 19, 2002
- NEC Compound Semiconductor Devices, Ltd.
- Mitsuhito Kanatake
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuhito KANATAKE

Person

Patents Grantslast 30 patents

Semiconductor package, semiconductor package manufacturing method,...

Semiconductor device, imaging apparatus, and method for manufacturi...

Method of manufacturing an optically coupled device

Optically coupled device with an optical waveguide

Semiconductor package having a resin cap member

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD F...

SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING SOLID-ST...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD,...

SEMICONDUCTOR DEVICE, IMAGING APPARATUS, AND METHOD FOR MANUFACTURI...

METHOD OF MANUFACTURING AN OPTICALLY COUPLED DEVICE

OPTICALLY COUPLED DEVICE AND METHOD OF MANUFACTURING THE SAME

Multi-channel photocoupling device and producing method thereof

Semiconductor package having a resin cap member