Mitsuhito Shibata

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Ageo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electrodeposited copper foil with its surface prepared, process for...
- Patent number 6,291,081
- Issue date Sep 18, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Hitoshi Kurabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR