Mitsuko Odagaki

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of performing electrolytic treatment on a conductive layer o...
- Patent number 7,387,717
- Issue date Jun 17, 2008
- Ebara Corporation
- Junji Kunisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus and substrate plating apparatus
- Patent number 7,208,074
- Issue date Apr 24, 2007
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate plating apparatus
- Patent number 6,689,257
- Issue date Feb 10, 2004
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus
- Patent number 6,632,335
- Issue date Oct 14, 2003
- Ebara Corporation
- Junji Kunisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PLATING APPARATUS
- Publication number 20080296165
- Publication date Dec 4, 2008
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20080251385
- Publication date Oct 16, 2008
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20060027452
- Publication date Feb 9, 2006
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20040134789
- Publication date Jul 15, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus
- Publication number 20040069646
- Publication date Apr 15, 2004
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method for substrate
- Publication number 20020020627
- Publication date Feb 21, 2002
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20020000371
- Publication date Jan 3, 2002
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor substrate processing apparatus and method
- Publication number 20010024691
- Publication date Sep 27, 2001
- Norio Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Mitsuko Odagaki

Person

Patents Grantslast 30 patents

Method of performing electrolytic treatment on a conductive layer o...

Substrate processing apparatus and substrate plating apparatus

Substrate processing apparatus and substrate plating apparatus

Plating apparatus

Patents Applicationslast 30 patents

PLATING APPARATUS

PLATING APPARATUS

Substrate processing apparatus and substrate plating apparatus

Substrate processing apparatus and substrate plating apparatus

Plating apparatus

Plating apparatus and plating method for substrate

Substrate processing apparatus and substrate plating apparatus

Semiconductor substrate processing apparatus and method