Mitsunada Osawa

Person

Ushiku-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method and mold for manufacturing semiconductor device, semiconduct...
- Patent number 6,881,611
- Issue date Apr 19, 2005
- Fujitsu Limited
- Norio Fukasawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor module including a plurality of semiconductor devices...
- Patent number 6,696,754
- Issue date Feb 24, 2004
- Fujitsu Limited
- Mitsutaka Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module including a plurality of semiconductor devices...
- Patent number 6,472,744
- Issue date Oct 29, 2002
- Fujitsu Limited
- Mitsutaka Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same and semicondu...
- Patent number 6,379,997
- Issue date Apr 30, 2002
- Fujitsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same and semicondu...
- Patent number 6,111,306
- Issue date Aug 29, 2000
- Fujitsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device having stacked wiring and i...
- Patent number 6,034,428
- Issue date Mar 7, 2000
- Fujitsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, semiconductor device using the composition an...
- Patent number 5,844,309
- Issue date Dec 1, 1998
- Fujitsu Limited
- Yukio Takigawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 5,804,467
- Issue date Sep 8, 1998
- Fujistsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having resin gate hole through substrate for r...
- Patent number 5,679,978
- Issue date Oct 21, 1997
- Fujitsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wire-bonding an integrated circuit
- Patent number 5,226,582
- Issue date Jul 13, 1993
- Fujitsu Limited
- Akihiro Kubota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor module including a plurality of semiconductor devices...
- Publication number 20030164544
- Publication date Sep 4, 2003
- FUJITSU LIMITED
- Mitsutaka Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and mold for manufacturing semiconductor device, semiconduct...
- Publication number 20020030258
- Publication date Mar 14, 2002
- FUJITSU LIMITED
- Norio Fukasawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE INCLUDING A PLURALITY OF SEMICONDUCTOR DEVICES...
- Publication number 20020000645
- Publication date Jan 3, 2002
- MITSUTAKA SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCT...
- Publication number 20010003049
- Publication date Jun 7, 2001
- NORIO FUKASAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Mitsunada Osawa

Person

Patents Grantslast 30 patents

Method and mold for manufacturing semiconductor device, semiconduct...

Semiconductor module including a plurality of semiconductor devices...

Semiconductor module including a plurality of semiconductor devices...

Semiconductor device and method of producing the same and semicondu...

Semiconductor device and method of producing the same and semicondu...

Semiconductor integrated circuit device having stacked wiring and i...

Adhesive composition, semiconductor device using the composition an...

Semiconductor device and method of producing the same

Semiconductor device having resin gate hole through substrate for r...

Method for wire-bonding an integrated circuit

Patents Applicationslast 30 patents

Semiconductor module including a plurality of semiconductor devices...

Method and mold for manufacturing semiconductor device, semiconduct...

SEMICONDUCTOR MODULE INCLUDING A PLURALITY OF SEMICONDUCTOR DEVICES...

METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCT...