Mitsunari Sukekawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive layers in memory array region and methods for forming th...
- Patent number 12,057,317
- Issue date Aug 6, 2024
- Micron Technology, Inc.
- Kenichi Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bit line noise suppression and related apparatuses, methods, and co...
- Patent number 11,961,579
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 11,917,814
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Mitsunari Sukekawa
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,917,808
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,844,208
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
Information Patent Grant
Integrated circuit constructions comprising memory and methods used...
- Patent number 11,785,781
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of capacitors, an array of memory cells, a method of forming...
- Patent number 11,744,061
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Sanh D. Tang
Information Patent Grant
Integrated assemblies comprising memory cells and shielding materia...
- Patent number 11,706,909
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,569,185
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 11,488,963
- Issue date Nov 1, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies comprising voids between active regions and c...
- Patent number 11,217,588
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of capacitors, an array of memory cells, a method of forming...
- Patent number 11,177,266
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of forming the same
- Patent number 11,171,140
- Issue date Nov 9, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies comprising spaces between bitlines and compri...
- Patent number 11,139,302
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies which include wordlines over gate electrodes
- Patent number 11,062,989
- Issue date Jul 13, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including capacitor structures, and related memory devi...
- Patent number 11,049,864
- Issue date Jun 29, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit constructions comprising memory and methods used...
- Patent number 11,037,940
- Issue date Jun 15, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of compensating for misalignment of bonded semiconductor wa...
- Patent number 11,031,374
- Issue date Jun 8, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies comprising memory cells and shielding materia...
- Patent number 10,910,379
- Issue date Feb 2, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuitry
- Patent number 10,868,078
- Issue date Dec 15, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuitry
- Patent number 10,867,837
- Issue date Dec 15, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with bitline noise suppressing scheme
- Patent number 10,861,787
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Array of recessed access devices and an array of memory cells indiv...
- Patent number 10,818,665
- Issue date Oct 27, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having plural chips connected by hybrid...
- Patent number 10,600,772
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Assemblies which include wordlines over gate electrodes
- Patent number 10,546,811
- Issue date Jan 28, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuitry
- Patent number 10,535,710
- Issue date Jan 14, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming integrated circuitry
- Patent number 10,504,961
- Issue date Dec 10, 2019
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuitry
- Patent number 10,410,912
- Issue date Sep 10, 2019
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having plural chips connected by hybrid...
- Patent number 10,340,261
- Issue date Jul 2, 2019
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming integrated circuitry
- Patent number 10,103,053
- Issue date Oct 16, 2018
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HYDROGEN INTRODUCTION LAYER PROVIDED...
- Publication number 20240170327
- Publication date May 23, 2024
- Micron Technology, Inc.
- MITSUNARI SUKEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT MICROELECTRONIC 6T SRAM MEMORY DEVICES, AND RELATED SYSTEMS...
- Publication number 20240074133
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING SEMICONDUCTIVE PILLAR STRUCTURES, AND RELATED...
- Publication number 20230397408
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIT LINE NOISE SUPPRESSION AND RELATED APPARATUSES, METHODS, AND CO...
- Publication number 20230377613
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230320072
- Publication date Oct 5, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230269932
- Publication date Aug 24, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230098062
- Publication date Mar 30, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Application
CONDUCTIVE LAYERS IN MEMORY ARRAY REGION AND METHODS FOR FORMING TH...
- Publication number 20230017813
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- KENICHI SUGINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20220122930
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20220059545
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20220059535
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20210296319
- Publication date Sep 23, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Circuit Constructions Comprising Memory And Methods Used...
- Publication number 20210233920
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array Of Capacitors, An Array Of Memory Cells, A Method Of Forming...
- Publication number 20210151440
- Publication date May 20, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Comprising Memory Cells and Shielding Materia...
- Publication number 20210074705
- Publication date Mar 11, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY OF CAPACITORS, AN ARRAY OF MEMORY CELLS, A METHOD OF FORMING...
- Publication number 20210066306
- Publication date Mar 4, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Comprising Voids Between Active Regions and C...
- Publication number 20210005611
- Publication date Jan 7, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Comprising Spaces Between Bitlines and Compri...
- Publication number 20200388619
- Publication date Dec 10, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING CAPACITOR STRUCTURES, AND RELATED MEMORY DEVI...
- Publication number 20200365595
- Publication date Nov 19, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Comprising Memory Cells and Shielding Materia...
- Publication number 20200295008
- Publication date Sep 17, 2020
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Compensating for Misalignment of Bonded Semiconductor Wa...
- Publication number 20200286859
- Publication date Sep 10, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array Of Recessed Access Devices And An Array Of Memory Cells Indiv...
- Publication number 20200066727
- Publication date Feb 27, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Which Include Wordlines Over Gate Electrodes
- Publication number 20200058584
- Publication date Feb 20, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE HAVING PLURAL CHIPS CONNECTED BY HYBRID...
- Publication number 20190363074
- Publication date Nov 28, 2019
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Integrated Circuitry
- Publication number 20190348464
- Publication date Nov 14, 2019
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Integrated Circuitry
- Publication number 20190304832
- Publication date Oct 3, 2019
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Constructions Comprising Memory And Methods Used...
- Publication number 20190296028
- Publication date Sep 26, 2019
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Integrated Circuitry
- Publication number 20190288034
- Publication date Sep 19, 2019
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Integrated Circuitry
- Publication number 20190288033
- Publication date Sep 19, 2019
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry
- Publication number 20190019722
- Publication date Jan 17, 2019
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS

Mitsunari Sukekawa

Person

Patents Grantslast 30 patents

Conductive layers in memory array region and methods for forming th...

Bit line noise suppression and related apparatuses, methods, and co...

Semiconductor device

Semiconductor device and method of forming the same

Semiconductor device and method of forming the same

Integrated circuit constructions comprising memory and methods used...

Array of capacitors, an array of memory cells, a method of forming...

Integrated assemblies comprising memory cells and shielding materia...

Semiconductor device and method of forming the same

Method of forming a semiconductor device

Integrated assemblies comprising voids between active regions and c...

Array of capacitors, an array of memory cells, a method of forming...

Semiconductor memory device and method of forming the same

Integrated assemblies comprising spaces between bitlines and compri...

Assemblies which include wordlines over gate electrodes

Apparatuses including capacitor structures, and related memory devi...

Integrated circuit constructions comprising memory and methods used...

Methods of compensating for misalignment of bonded semiconductor wa...

Integrated assemblies comprising memory cells and shielding materia...

Methods of forming integrated circuitry

Methods of forming integrated circuitry

Memory device with bitline noise suppressing scheme

Array of recessed access devices and an array of memory cells indiv...

Semiconductor memory device having plural chips connected by hybrid...

Assemblies which include wordlines over gate electrodes

Methods of forming integrated circuitry

Methods of forming integrated circuitry

Integrated circuitry

Semiconductor memory device having plural chips connected by hybrid...

Methods of forming integrated circuitry

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING HYDROGEN INTRODUCTION LAYER PROVIDED...

COMPACT MICROELECTRONIC 6T SRAM MEMORY DEVICES, AND RELATED SYSTEMS...

APPARATUSES INCLUDING SEMICONDUCTIVE PILLAR STRUCTURES, AND RELATED...

BIT LINE NOISE SUPPRESSION AND RELATED APPARATUSES, METHODS, AND CO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

CONDUCTIVE LAYERS IN MEMORY ARRAY REGION AND METHODS FOR FORMING TH...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

METHOD OF FORMING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME

Integrated Circuit Constructions Comprising Memory And Methods Used...

Array Of Capacitors, An Array Of Memory Cells, A Method Of Forming...

Integrated Assemblies Comprising Memory Cells and Shielding Materia...

ARRAY OF CAPACITORS, AN ARRAY OF MEMORY CELLS, A METHOD OF FORMING...

Integrated Assemblies Comprising Voids Between Active Regions and C...

Integrated Assemblies Comprising Spaces Between Bitlines and Compri...

APPARATUSES INCLUDING CAPACITOR STRUCTURES, AND RELATED MEMORY DEVI...

Integrated Assemblies Comprising Memory Cells and Shielding Materia...

Methods of Compensating for Misalignment of Bonded Semiconductor Wa...

Array Of Recessed Access Devices And An Array Of Memory Cells Indiv...

Assemblies Which Include Wordlines Over Gate Electrodes

SEMICONDUCTOR MEMORY DEVICE HAVING PLURAL CHIPS CONNECTED BY HYBRID...

Methods of Forming Integrated Circuitry

Methods of Forming Integrated Circuitry

Integrated Circuit Constructions Comprising Memory And Methods Used...

Methods of Forming Integrated Circuitry

Methods of Forming Integrated Circuitry

Integrated Circuitry