Mitsuo Honda

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Niigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for controlling thickness of wafer-like work pieces under la...
- Patent number 4,433,510
- Issue date Feb 28, 1984
- Shin-Etsu Engineering Co., Ltd.
- Kiyoo Katagiri
- B24 - GRINDING POLISHING