Mitsuru Nitta

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Large scale integrated circuit package
- Patent number 4,754,371
- Issue date Jun 28, 1988
- NEC Corporation
- Mitsuru Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for a chip
- Patent number 4,731,699
- Issue date Mar 15, 1988
- NEC Corporation
- Mitsuru Nitta
- H01 - BASIC ELECTRIC ELEMENTS