Mitsuru Oota

Follow

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor device having bonding pad of the...
- Patent number 7,331,737
- Issue date Feb 19, 2008
- NEC Electronics Corporation
- Mitsuru Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having bonding pad of the first chip thicker t...
- Patent number 7,256,485
- Issue date Aug 14, 2007
- NEC Electronics Corporation
- Mitsuru Oota
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20070224805
- Publication date Sep 27, 2007
- NEC ELECTRONICS CORPORATION
- Mitsuru Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20060220231
- Publication date Oct 5, 2006
- NEC Electronics Corporation
- Mitsuru Oota
- H01 - BASIC ELECTRIC ELEMENTS