Mitsuru Ozono

Person

Chikushino-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component bonding method, component laminating method and bonded co...
- Patent number 8,614,118
- Issue date Dec 24, 2013
- Panasonic Corporation
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip pickup apparatus, chip pickup method, chip releasing device an...
- Patent number 8,192,578
- Issue date Jun 5, 2012
- Panasonic Corporation
- Hiroshi Haji
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component soldering structure and electronic component s...
- Patent number 8,148,253
- Issue date Apr 3, 2012
- Panasonic Corporation
- Mitsuru Ozono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for picking up semiconductor chip and suction...
- Patent number 7,632,374
- Issue date Dec 15, 2009
- Panasonic Corporation
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering electronic component and soldering structure o...
- Patent number 7,632,710
- Issue date Dec 15, 2009
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for assembling the same
- Patent number 7,446,423
- Issue date Nov 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus and method of mounting elec...
- Patent number 7,409,761
- Issue date Aug 12, 2008
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,852,572
- Issue date Feb 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste ejection apparatus
- Patent number 6,808,086
- Issue date Oct 26, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shinji Sasaguri
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Semiconductor device, method of manufacturing the device and method...
- Patent number 6,797,544
- Issue date Sep 28, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste applicator and paste application method for die bonding
- Patent number 6,685,777
- Issue date Feb 3, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device assembly
- Patent number 6,617,675
- Issue date Sep 9, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding paste applicator and method of using it
- Patent number 6,605,315
- Issue date Aug 12, 2003
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying bonding paste
- Patent number 6,460,756
- Issue date Oct 8, 2002
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste application method for die bonding
- Patent number 6,361,831
- Issue date Mar 26, 2002
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste applying method
- Patent number 6,348,234
- Issue date Feb 19, 2002
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting bumped electronic components
- Patent number 6,209,196
- Issue date Apr 3, 2001
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of soldering bumped work by partially penetrating the oxide...
- Patent number 6,179,198
- Issue date Jan 30, 2001
- Matsushita Electric Industrial Co., Ltd.
- Hideki Eifuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AN...
- Publication number 20090279995
- Publication date Nov 12, 2009
- PANASONIC CORPORATION
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE O...
- Publication number 20090233117
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT PICKUP METHOD, ELECTRONIC COMPONENT MOUNTING M...
- Publication number 20090202333
- Publication date Aug 13, 2009
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT SOLDERING STRUCTURE AND ELECTRONIC COMPONENT S...
- Publication number 20090075025
- Publication date Mar 19, 2009
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Component Bonding Method, Component Laminating Method And Bonded Co...
- Publication number 20090035892
- Publication date Feb 5, 2009
- Matsushita Electric Industrial Co. Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Pickup Method, Electronic Component Mounting M...
- Publication number 20090000109
- Publication date Jan 1, 2009
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Mounting Apparatus And method Of Mounting Elec...
- Publication number 20080104831
- Publication date May 8, 2008
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for assembling the same
- Publication number 20050116323
- Publication date Jun 2, 2005
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Paste ejection apparatus
- Publication number 20040069801
- Publication date Apr 15, 2004
- Shinji Sasaguri
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Application
Method and apparatus for picking up semiconductor chip and suction...
- Publication number 20040038498
- Publication date Feb 26, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and semiconductor device assembly
- Publication number 20020084470
- Publication date Jul 4, 2002
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of manufacturing the device and mehtod...
- Publication number 20020048906
- Publication date Apr 25, 2002
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Paste applicator and paste application method for die bonding
- Publication number 20020037372
- Publication date Mar 28, 2002
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of applying bonding paste
- Publication number 20020014519
- Publication date Feb 7, 2002
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20010018233
- Publication date Aug 30, 2001
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuru Ozono

Person

Patents Grantslast 30 patents

Component bonding method, component laminating method and bonded co...

Chip pickup apparatus, chip pickup method, chip releasing device an...

Electronic component soldering structure and electronic component s...

Method and apparatus for picking up semiconductor chip and suction...

Method for soldering electronic component and soldering structure o...

Semiconductor device and method for assembling the same

Electronic component mounting apparatus and method of mounting elec...

Method of manufacturing semiconductor device

Paste ejection apparatus

Semiconductor device, method of manufacturing the device and method...

Paste applicator and paste application method for die bonding

Semiconductor device and semiconductor device assembly

Bonding paste applicator and method of using it

Method of applying bonding paste

Paste application method for die bonding

Paste applying method

Method of mounting bumped electronic components

Method of soldering bumped work by partially penetrating the oxide...

Patents Applicationslast 30 patents

CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AN...

METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE O...

ELECTRONIC COMPONENT PICKUP METHOD, ELECTRONIC COMPONENT MOUNTING M...

ELECTRONIC COMPONENT SOLDERING STRUCTURE AND ELECTRONIC COMPONENT S...

Component Bonding Method, Component Laminating Method And Bonded Co...

Electronic Component Pickup Method, Electronic Component Mounting M...

Electronic Component Mounting Apparatus And method Of Mounting Elec...

Semiconductor device and method for assembling the same

Paste ejection apparatus

Method and apparatus for picking up semiconductor chip and suction...

Semiconductor device and semiconductor device assembly

Semiconductor device, method of manufacturing the device and mehtod...

Paste applicator and paste application method for die bonding

Method of applying bonding paste

Method of manufacturing semiconductor device