Mitsuru TAKAHIRA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an interlayer connection substrate
- Patent number 9,320,154
- Issue date Apr 19, 2016
- Hitachi, Ltd.
- Akira Soeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERLAYER CONNECTION SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20140353018
- Publication date Dec 4, 2014
- Hitachi, Ltd
- Akira SOEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR