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Mitsutaka Matsuo
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Hyogo, JP
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last 30 patents
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Patent Grant
Method of forming leads of a semiconductor device
Patent number
7,077,170
Issue date
Jul 18, 2006
Renesas Technology Corp.
Hidetaka Yamasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Method of forming leads of a packaged semiconductor device
Publication number
20060237087
Publication date
Oct 26, 2006
Renesas Technology Corp.
Hidetaka Yamasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Lead forming for a semiconductor device
Publication number
20050076967
Publication date
Apr 14, 2005
Renesas Technology Corp.
Hidetaka Yamasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR