Mitsutoshi Higashi

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer and semiconductor device including the same
- Patent number 9,591,742
- Issue date Mar 7, 2017
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device that includes wavelength conversion layer hav...
- Patent number 9,099,615
- Issue date Aug 4, 2015
- Koito Manufacturing Co., Ltd.
- Yasuaki Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card and manufacturing method thereof
- Patent number 9,052,341
- Issue date Jun 9, 2015
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- G01 - MEASURING TESTING
Information Patent Grant
Test-use individual substrate, probe, and semiconductor wafer testi...
- Patent number 8,922,232
- Issue date Dec 30, 2014
- Advantest Corporation
- Shigeru Matsumura
- G01 - MEASURING TESTING
Information Patent Grant
Probe card and method for manufacturing probe card
- Patent number 8,922,234
- Issue date Dec 30, 2014
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component device, method of manufacturing the same and w...
- Patent number 8,878,357
- Issue date Nov 4, 2014
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
- Patent number 8,810,007
- Issue date Aug 19, 2014
- Shinko Electric Industries Co., Ltd.
- Akihito Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 8,777,638
- Issue date Jul 15, 2014
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate manufacturing method
- Patent number 8,671,561
- Issue date Mar 18, 2014
- Shinko Electric Industries Co., Ltd.
- Kiyoaki Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
- Patent number 8,669,643
- Issue date Mar 11, 2014
- Shinko Electric Industries Co., Ltd.
- Akihito Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device and package component
- Patent number 8,611,389
- Issue date Dec 17, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for electronic component, manufacturing method thereof and...
- Patent number 8,564,077
- Issue date Oct 22, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 8,481,863
- Issue date Jul 9, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat radiation package and semiconductor device
- Patent number 8,368,206
- Issue date Feb 5, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor chip including a semiconduc...
- Patent number 8,338,289
- Issue date Dec 25, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 8,304,862
- Issue date Nov 6, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 8,299,370
- Issue date Oct 30, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,227,909
- Issue date Jul 24, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Production methods of electronic devices
- Patent number 8,216,884
- Issue date Jul 10, 2012
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic part package
- Patent number 8,183,679
- Issue date May 22, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device, and method of manufacturing the same
- Patent number 8,178,957
- Issue date May 15, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and electronic apparatus of multi-chip packaging
- Patent number 8,169,073
- Issue date May 1, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an element mounted on a substrate and a...
- Patent number 8,148,738
- Issue date Apr 3, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 8,137,497
- Issue date Mar 20, 2012
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate, and method of manufacturi...
- Patent number 8,108,993
- Issue date Feb 7, 2012
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon substrate for package
- Patent number 8,106,484
- Issue date Jan 31, 2012
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate and method of manufacturin...
- Patent number 8,080,122
- Issue date Dec 20, 2011
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 8,053,886
- Issue date Nov 8, 2011
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 8,044,429
- Issue date Oct 25, 2011
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring substrate with a wire terminal
- Patent number 8,039,967
- Issue date Oct 18, 2011
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20140362552
- Publication date Dec 11, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD
- Publication number 20140055157
- Publication date Feb 27, 2014
- Shinko Electric Industries Co., LTD.
- Akinori Shiraishi
- G01 - MEASURING TESTING
Information Patent Application
Light Emitting Device
- Publication number 20130121009
- Publication date May 16, 2013
- Shinko Electric Industries Co., Ltd.
- Yasuaki Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120325529
- Publication date Dec 27, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki SAKAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
Wiring Board, Semiconductor Device, and Method for Manufacturing Wi...
- Publication number 20120261801
- Publication date Oct 18, 2012
- Taiyo Yuden Co., Ltd.
- Akihito TAKANO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Wiring Board, Semiconductor Device, and Method for Manufacturing Wi...
- Publication number 20120261832
- Publication date Oct 18, 2012
- Taiyo Yuden Co., Ltd.
- Akihito TAKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROBE CARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120229157
- Publication date Sep 13, 2012
- Shinko Electric Industries Co., Ltd.
- Akinori SHIRAISHI
- G01 - MEASURING TESTING
Information Patent Application
LIGHT EMITTING DEVICE AND PACKAGE COMPONENT
- Publication number 20120128021
- Publication date May 24, 2012
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND W...
- Publication number 20120086116
- Publication date Apr 12, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TEST-USE INDIVIDUAL SUBSTRATE, PROBE, AND SEMICONDUCTOR WAFER TESTI...
- Publication number 20120049876
- Publication date Mar 1, 2012
- Shinko Electric Industries Co., Ltd.
- Shigeru MATSUMURA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC PART PACKAGE
- Publication number 20110266697
- Publication date Nov 3, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki SAKAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD
- Publication number 20110260744
- Publication date Oct 27, 2011
- Shinko Electric Industries Co., LTD.
- Akinori Shiraishi
- G01 - MEASURING TESTING
Information Patent Application
SILICON SUBSTRATE FOR PACKAGE
- Publication number 20110227218
- Publication date Sep 22, 2011
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156242
- Publication date Jun 30, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING ELECTRONIC PART PACKAGE
- Publication number 20110092020
- Publication date Apr 21, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki SAKAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110032710
- Publication date Feb 10, 2011
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110027990
- Publication date Feb 3, 2011
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING APPARATUS
- Publication number 20100321936
- Publication date Dec 23, 2010
- SHINKO ELECTRICAL INDUSTRIES CO., LTD.
- Mitsutoshi HIGASHI
- F21 - LIGHTING
Information Patent Application
CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD
- Publication number 20100230469
- Publication date Sep 16, 2010
- Shinko Electric Industries Co., Ltd.
- Kiyoaki IIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100212950
- Publication date Aug 26, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki SAKAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100207218
- Publication date Aug 19, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MOUNTING...
- Publication number 20100193939
- Publication date Aug 5, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND...
- Publication number 20100155862
- Publication date Jun 24, 2010
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20100155928
- Publication date Jun 24, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING ELECTRONIC PART PACKAGE
- Publication number 20100062564
- Publication date Mar 11, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki SAKAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20100038772
- Publication date Feb 18, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100001304
- Publication date Jan 7, 2010
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE AND CHIP TRAY
- Publication number 20090300911
- Publication date Dec 10, 2009
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20090242107
- Publication date Oct 1, 2009
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURI...
- Publication number 20090236024
- Publication date Sep 24, 2009
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi HIGASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mitsutoshi Higashi

Person

Patents Grantslast 30 patents

Interposer and semiconductor device including the same

Light emitting device that includes wavelength conversion layer hav...

Probe card and manufacturing method thereof

Test-use individual substrate, probe, and semiconductor wafer testi...

Probe card and method for manufacturing probe card

Electronic component device, method of manufacturing the same and w...

Wiring board, semiconductor device, and method for manufacturing wi...

Wiring board and method of manufacturing the same

Substrate manufacturing method

Wiring board, semiconductor device, and method for manufacturing wi...

Light emitting device and package component

Package for electronic component, manufacturing method thereof and...

Substrate and method for manufacturing the same

Heat radiation package and semiconductor device

Method of manufacturing a semiconductor chip including a semiconduc...

Semiconductor package and manufacturing method of the same

Wiring board and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Production methods of electronic devices

Electronic part package

Electronic component device, and method of manufacturing the same

Semiconductor device and electronic apparatus of multi-chip packaging

Semiconductor device having an element mounted on a substrate and a...

Method of manufacturing wiring substrate

Method of manufacturing wiring substrate, and method of manufacturi...

Silicon substrate for package

Method of manufacturing wiring substrate and method of manufacturin...

Semiconductor package and manufacturing method thereof

Light-emitting device and method for manufacturing the same

Wiring substrate with a wire terminal

Patents Applicationslast 30 patents

INTERPOSER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD

Light Emitting Device

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Wiring Board, Semiconductor Device, and Method for Manufacturing Wi...

Wiring Board, Semiconductor Device, and Method for Manufacturing Wi...

PROBE CARD AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING DEVICE AND PACKAGE COMPONENT

ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND W...

TEST-USE INDIVIDUAL SUBSTRATE, PROBE, AND SEMICONDUCTOR WAFER TESTI...

ELECTRONIC PART PACKAGE

PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD

SILICON SUBSTRATE FOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR PRODUCING ELECTRONIC PART PACKAGE

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME

LIGHTING APPARATUS

CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MOUNTING...

PACKAGE FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

METHOD FOR PRODUCING ELECTRONIC PART PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING WIRING SUBSTRATE AND CHIP TRAY

METHOD OF MANUFACTURING WIRING SUBSTRATE

METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURI...