Mitsutoshi YAHAGI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pre-wet module, deaerated liquid circulation system, and pre-wet me...
- Patent number 12,076,760
- Issue date Sep 3, 2024
- Ebara Corporation
- Masaya Seki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pre-wet module, deaerated liquid circulation system, and pre-wet me...
- Patent number 11,833,551
- Issue date Dec 5, 2023
- Ebara Corporation
- Masaya Seki
- B08 - CLEANING
Information Patent Grant
Leak checking method, leak checking apparatus, electroplating metho...
- Patent number 10,982,347
- Issue date Apr 20, 2021
- Ebara Corporation
- Shoichiro Ogata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Current measuring module using inspection substrate and inspection...
- Patent number 10,830,834
- Issue date Nov 10, 2020
- Ebara Corporation
- Masaki Tomita
- G01 - MEASURING TESTING
Information Patent Grant
Plating apparatus, plating method, and substrate holder
- Patent number 10,513,795
- Issue date Dec 24, 2019
- Ebara Corporation
- Junko Mine
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leak checking method, leak checking apparatus, electroplating metho...
- Patent number 10,458,036
- Issue date Oct 29, 2019
- Ebara Corporation
- Shoichiro Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus, plating method, and substrate holder
- Patent number 10,316,426
- Issue date Jun 11, 2019
- Ebara Corporation
- Junko Mine
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder, plating apparatus, and plating method
- Patent number 10,316,425
- Issue date Jun 11, 2019
- Ebara Corporation
- Toshikazu Yajima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anode holder and plating apparatus
- Patent number 10,240,247
- Issue date Mar 26, 2019
- Ebara Corporation
- Mitsutoshi Yahagi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 10,214,830
- Issue date Feb 26, 2019
- Ebara Corporation
- Mitsutoshi Yahagi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 10,106,906
- Issue date Oct 23, 2018
- Ebara Corporation
- Masaaki Kimura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anode unit and plating apparatus having such anode unit
- Patent number 9,708,724
- Issue date Jul 18, 2017
- Ebara Corporation
- Junichiro Tsujino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D758973
- Issue date Jun 14, 2016
- Ebara Corporation
- Jumpei Fujikata
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D742329
- Issue date Nov 3, 2015
- Ebara Corporation
- Jumpei Fujikata
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D725600
- Issue date Mar 31, 2015
- Ebara Corporation
- Jumpei Fujikata
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D719101
- Issue date Dec 9, 2014
- Ebara Corporation
- Masaaki Kimura
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D717736
- Issue date Nov 18, 2014
- Ebara Corporation
- Masaaki Kimura
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D706224
- Issue date Jun 3, 2014
- Ebara Corporation
- Masaaki Kimura
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Sealing ring
- Patent number D705280
- Issue date May 20, 2014
- Ebara Corporation
- Masaaki Kimura
- D15 - Machines not elsewhere specified
Information Patent Grant
Conducting belt for use with anode holder and anode holder
- Patent number 7,897,024
- Issue date Mar 1, 2011
- Ebara Corporation
- Mitsutoshi Yahagi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D556692
- Issue date Dec 4, 2007
- Ebara Corporation
- Mitsutoshi Yahagi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D555595
- Issue date Nov 20, 2007
- Ebara Corporation
- Mitsutoshi Yahagi
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET ME...
- Publication number 20240050992
- Publication date Feb 15, 2024
- EBARA CORPORATION
- Masaya SEKI
- B08 - CLEANING
Information Patent Application
PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET ME...
- Publication number 20220379352
- Publication date Dec 1, 2022
- EBARA CORPORATION
- Masaya SEKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...
- Publication number 20210198800
- Publication date Jul 1, 2021
- EBARA CORPORATION
- Shoichiro OGATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...
- Publication number 20200010972
- Publication date Jan 9, 2020
- EBARA CORPORATION
- Shoichiro OGATA
- G01 - MEASURING TESTING
Information Patent Application
PLATING APPARATUS, PLATING METHOD, AND SUBSTRATE HOLDER
- Publication number 20190249326
- Publication date Aug 15, 2019
- EBARA CORPORATION
- Junko MINE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CURRENT MEASURING MODULE USING INSPECTION SUBSTRATE AND INSPECTION...
- Publication number 20190219627
- Publication date Jul 18, 2019
- EBARA CORPORATION
- Masaki TOMITA
- G01 - MEASURING TESTING
Information Patent Application
LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...
- Publication number 20180135198
- Publication date May 17, 2018
- EBARA CORPORATION
- Shoichiro OGATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, PLATING METHOD, AND SUBSTRATE HOLDER
- Publication number 20170058423
- Publication date Mar 2, 2017
- EBARA CORPORATION
- Junko MINE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANODE HOLDER AND PLATING APPARATUS
- Publication number 20160369421
- Publication date Dec 22, 2016
- EBARA CORPORATION
- Mitsutoshi YAHAGI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20160258080
- Publication date Sep 8, 2016
- EBARA CORPORATION
- Masaaki KIMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND PLATING APPARATUS
- Publication number 20160108539
- Publication date Apr 21, 2016
- EBARA CORPORATION
- Mitsutoshi YAHAGI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANODE UNIT AND PLATING APPARATUS HAVING SUCH ANODE UNIT
- Publication number 20150275390
- Publication date Oct 1, 2015
- EBARA CORPORATION
- Junichiro TSUJINO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, PLATING APPARATUS, AND PLATING METHOD
- Publication number 20150247253
- Publication date Sep 3, 2015
- EBARA CORPORATION
- Toshikazu YAJIMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING APPARATUS
- Publication number 20140360865
- Publication date Dec 11, 2014
- Masaaki KIMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conducting belt for use with anode holder and anode holder
- Publication number 20090050473
- Publication date Feb 26, 2009
- Mitsutoshi Yahagi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Mitsutoshi YAHAGI

Person

Patents Grantslast 30 patents

Pre-wet module, deaerated liquid circulation system, and pre-wet me...

Pre-wet module, deaerated liquid circulation system, and pre-wet me...

Leak checking method, leak checking apparatus, electroplating metho...

Current measuring module using inspection substrate and inspection...

Plating apparatus, plating method, and substrate holder

Leak checking method, leak checking apparatus, electroplating metho...

Plating apparatus, plating method, and substrate holder

Substrate holder, plating apparatus, and plating method

Anode holder and plating apparatus

Substrate holder and plating apparatus

Plating apparatus

Anode unit and plating apparatus having such anode unit

Electrical contact for use in a plating apparatus

Electrical contact for use in a plating apparatus

Electrical contact for use in a plating apparatus

Electrical contact for use in a plating apparatus

Electrical contact for use in a plating apparatus

Electrical contact for use in a plating apparatus

Sealing ring

Conducting belt for use with anode holder and anode holder

Electrical contact for use in a plating apparatus

Electrical contact for use in a plating apparatus

Patents Applicationslast 30 patents

PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET ME...

PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET ME...

LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...

LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...

PLATING APPARATUS, PLATING METHOD, AND SUBSTRATE HOLDER

CURRENT MEASURING MODULE USING INSPECTION SUBSTRATE AND INSPECTION...

LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...

PLATING APPARATUS, PLATING METHOD, AND SUBSTRATE HOLDER

ANODE HOLDER AND PLATING APPARATUS

PLATING APPARATUS

SUBSTRATE HOLDER AND PLATING APPARATUS

ANODE UNIT AND PLATING APPARATUS HAVING SUCH ANODE UNIT

SUBSTRATE HOLDER, PLATING APPARATUS, AND PLATING METHOD

COPPER ELECTROPLATING APPARATUS

Conducting belt for use with anode holder and anode holder