Mitsuyasu ENOMOTO

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Anjo-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin molded semiconductor device
- Patent number 7,830,023
- Issue date Nov 9, 2010
- Denso Corporation
- Mitsuyasu Enomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed electronic device and method of manufacturing the same
- Patent number 7,786,606
- Issue date Aug 31, 2010
- DENSO CORPORATION
- Mitsuyasu Enomoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Load driver circuit and ignition device using the same
- Patent number 7,663,857
- Issue date Feb 16, 2010
- Denso Corporation
- Mitsuyasu Enomoto
- F23 - COMBUSTION APPARATUS COMBUSTION PROCESSES

Patents Applicationslast 30 patents

Information Patent Application
RESIN MOLDED SEMICONDUCTOR DEVICE
- Publication number 20080296783
- Publication date Dec 4, 2008
- DENSO CORPORATION
- Mitsuyasu ENOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD DRIVER CIRCUIT AND IGNITION DEVICE USING THE SAME
- Publication number 20080151448
- Publication date Jun 26, 2008
- DENSO CORPORATION
- Mitsuyasu ENOMOTO
- F23 - COMBUSTION APPARATUS COMBUSTION PROCESSES
Information Patent Application
RESIN-SEALED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080128920
- Publication date Jun 5, 2008
- DENSO CORPORATION
- Mitsuyasu Enomoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Engine abnormal condition detecting device
- Publication number 20080007266
- Publication date Jan 10, 2008
- DENSO CORPORATION
- Mitsuyasu Enomoto
- G01 - MEASURING TESTING