Mitsuyasu Matsuo

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Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Cooling device, semiconductor laser light source device, semiconduc...
- Patent number 6,970,485
- Issue date Nov 29, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Jiro Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package and manufacturing method of the same
- Patent number 6,191,493
- Issue date Feb 20, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package and manufacturing method of the same
- Patent number 5,920,770
- Issue date Jul 6, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package
- Patent number 5,753,973
- Issue date May 19, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package
- Patent number 5,656,863
- Issue date Aug 12, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS