Mitsuyoshi Hamada

Person

Abiko-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin molding material for sealing and electronic component d...
- Patent number 10,662,315
- Issue date May 26, 2020
- Hitachi Chemical Company, Ltd.
- Mitsuyoshi Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor element mounting substrate and optical semico...
- Patent number 10,381,533
- Issue date Aug 13, 2019
- Hitachi Chemical Company, Ltd.
- Hayato Kotani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thermosetting resin composition for light reflection, method for ma...
- Patent number 9,387,608
- Issue date Jul 12, 2016
- Hitachi Chemical Company, Ltd.
- Hayato Kotani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Epoxy resin molding material for sealing and electronic component d...
- Patent number 8,084,130
- Issue date Dec 27, 2011
- Hitachi Chemical Co., Ltd.
- Mitsuyoshi Hamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Nitrogen-containing organosilicon compound method of manufacture, a...
- Patent number 7,838,671
- Issue date Nov 23, 2010
- Dow Corning Toray Company, Ltd.
- Makoto Iwai
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Nitrogen-containing organosilicon compound, method of manufacture,...
- Patent number 7,326,800
- Issue date Feb 5, 2008
- Dow Corning Toray Company, Ltd.
- Makoto Iwai
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...
- Publication number 20170121505
- Publication date May 4, 2017
- Hitachi Chemical Company, Ltd.
- Mitsuyoshi Hamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICO...
- Publication number 20170040513
- Publication date Feb 9, 2017
- Hitachi Chemical Company, Ltd.
- Hayato Kotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...
- Publication number 20140128505
- Publication date May 8, 2014
- HITACHI CHEMICAL COMPANY, LTD.
- Mitsuyoshi Hamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, METHOD FOR MA...
- Publication number 20100140638
- Publication date Jun 10, 2010
- HITACHI CHEMICAL CO., Ltd.
- Hayato Kotani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...
- Publication number 20090326100
- Publication date Dec 31, 2009
- Mitsuyoshi Hamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin Molding Material for Sealing, and Electronic Component...
- Publication number 20090247670
- Publication date Oct 1, 2009
- Mitsuyoshi Hamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin Molding Material for Sealing and Electronic Component D...
- Publication number 20090012233
- Publication date Jan 8, 2009
- Mitsuyoshi Hamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Nitrogen-Containing Organosilicon Compound Method Of Manufacture, A...
- Publication number 20080177065
- Publication date Jul 24, 2008
- DOW CORNING TORAY COMPANY, LTD.
- Makoto Iwai
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Nitrogen-containing organosilicon compound, method of manufacture,...
- Publication number 20060287546
- Publication date Dec 21, 2006
- Makoto Iwai
- C07 - ORGANIC CHEMISTRY

Mitsuyoshi Hamada

Person

Patents Grantslast 30 patents

Epoxy resin molding material for sealing and electronic component d...

Optical semiconductor element mounting substrate and optical semico...

Thermosetting resin composition for light reflection, method for ma...

Epoxy resin molding material for sealing and electronic component d...

Nitrogen-containing organosilicon compound method of manufacture, a...

Nitrogen-containing organosilicon compound, method of manufacture,...

Patents Applicationslast 30 patents

EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...

OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICO...

EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...

THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, METHOD FOR MA...

EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...

Epoxy Resin Molding Material for Sealing, and Electronic Component...

Epoxy Resin Molding Material for Sealing and Electronic Component D...

Nitrogen-Containing Organosilicon Compound Method Of Manufacture, A...

Nitrogen-containing organosilicon compound, method of manufacture,...