Mitsuyoshi Imai

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Nagano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 8,945,336
- Issue date Feb 3, 2015
- Shinko Electric Industries Co., Ltd.
- Atsushi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,901,997
- Issue date Mar 8, 2011
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin for semiconductor wire
- Patent number 6,700,198
- Issue date Mar 2, 2004
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate for producing semiconductor device
- Patent number 6,348,416
- Issue date Feb 19, 2002
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20140001648
- Publication date Jan 2, 2014
- Atsushi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080188040
- Publication date Aug 7, 2008
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Resin for semiconductor wire
- Publication number 20020019133
- Publication date Feb 14, 2002
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS