Mitsuyoshi Matsuda

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrolytic copper foil
- Patent number 12,168,838
- Issue date Dec 17, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Daisuke Nakajima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electro-deposited copper-alloy foil and electro-deposited copper-al...
- Patent number 9,663,868
- Issue date May 30, 2017
- Mitsui Mining & Smelting Co., Ltd.
- Mitsuyoshi Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of producing a printed wiring board
- Patent number 9,338,898
- Issue date May 10, 2016
- Mitsui Mining & Smelting Co., Ltd.
- Joji Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electro-deposited copper foil, surface-treated copper foil using th...
- Patent number 9,307,639
- Issue date Apr 5, 2016
- Mitsui Mining & Smelting Co., Ltd.
- Hisao Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited copper foil, its manufacturing method, surface-tre...
- Patent number 8,722,199
- Issue date May 13, 2014
- Mitsui Mining & Smelting Co., Ltd.
- Mitsuyoshi Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated electro-deposited copper foil and method for manufa...
- Patent number 8,715,836
- Issue date May 6, 2014
- Mitsui Mining & Smelting Co., Ltd.
- Makoto Dobashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing electrolytic copper solution acidified with sul...
- Patent number 8,419,920
- Issue date Apr 16, 2013
- Mitsui Mining & Smelting Co., Ltd.
- Sakiko Tomonaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated copper foil low-dielectric substrate and copper-cla...
- Patent number 6,969,557
- Issue date Nov 29, 2005
- Mitsui Mining & Smelting Co., Ltd.
- Mitsuyoshi Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLYTIC COPPER FOIL
- Publication number 20230074384
- Publication date Mar 9, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER FOIL
- Publication number 20230044366
- Publication date Feb 9, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PRODUCING PRINTED WIRING BOARD AND COPPER FOIL FOR LASER...
- Publication number 20130247373
- Publication date Sep 26, 2013
- Joji FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRO-DEPOSITED COPPER-ALLOY FOIL AND ELECTRO-DEPOSITED COPPER-AL...
- Publication number 20130171457
- Publication date Jul 4, 2013
- Mitsui Mining and Smelting Co., Ltd.
- Mitsuyoshi MATSUDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SUL...
- Publication number 20100089758
- Publication date Apr 15, 2010
- Mitsui Mining and Smelting Co., Ltd.
- Sakiko Tomonaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposited copper foil, its manufacturing method, surface-tre...
- Publication number 20100038115
- Publication date Feb 18, 2010
- Mitsui Mining and Smelting Co., Ltd.
- Mitsuyoshi Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSIT...
- Publication number 20090166213
- Publication date Jul 2, 2009
- Mitsui Mining and Smelting Co., Ltd.
- Makoto Dobashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRO-DEPOSITED COPPER FOIL, SURFACE-TREATED COPPER FOIL USING TH...
- Publication number 20090095515
- Publication date Apr 16, 2009
- Mitsui Mining and Smelting Co., Ltd.
- Hisao Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFA...
- Publication number 20090047539
- Publication date Feb 19, 2009
- Mitsui Mining and Smelting Co., Ltd.
- Makoto Dobashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface treatment copper foil for low dielectric substrate, copper...
- Publication number 20040191560
- Publication date Sep 30, 2004
- Mitsuyoshi Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Mitsuyoshi Matsuda

Person

Patents Grantslast 30 patents

Electrolytic copper foil

Electro-deposited copper-alloy foil and electro-deposited copper-al...

Method of producing a printed wiring board

Electro-deposited copper foil, surface-treated copper foil using th...

Electrodeposited copper foil, its manufacturing method, surface-tre...

Surface-treated electro-deposited copper foil and method for manufa...

Method of preparing electrolytic copper solution acidified with sul...

Surface-treated copper foil low-dielectric substrate and copper-cla...

Patents Applicationslast 30 patents

ELECTROLYTIC COPPER FOIL

ELECTROLYTIC COPPER FOIL

METHOD OF PRODUCING PRINTED WIRING BOARD AND COPPER FOIL FOR LASER...

ELECTRO-DEPOSITED COPPER-ALLOY FOIL AND ELECTRO-DEPOSITED COPPER-AL...

METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SUL...

Electrodeposited copper foil, its manufacturing method, surface-tre...

PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSIT...

ELECTRO-DEPOSITED COPPER FOIL, SURFACE-TREATED COPPER FOIL USING TH...

SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFA...

Surface treatment copper foil for low dielectric substrate, copper...