Mitsuyuki Takayasu

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Ishikawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 8,112,881
- Issue date Feb 14, 2012
- Tessera Interconnect Materials, Inc.
- Kazuhiro Shimizu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer printed circuit board and method for manufacturing same
- Patent number 7,963,030
- Issue date Jun 21, 2011
- Sony Chemical & Information Device Corporation
- Kazuhiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20090288857
- Publication date Nov 26, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazuhiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Manufacturing Multilayer Wiring Board
- Publication number 20080110018
- Publication date May 15, 2008
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazuhiro Shimizu
- B32 - LAYERED PRODUCTS