Mituo Kato

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and testing apparatus of a bonded portion
- Patent number 5,323,952
- Issue date Jun 28, 1994
- Hitachi, Ltd.
- Mituo Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and cooling device of the same
- Patent number 4,996,589
- Issue date Feb 26, 1991
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS