Miyoko Ikishima

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Double-sided pressure-sensitive adhesive tape or sheet for wiring c...
- Patent number 7,927,697
- Issue date Apr 19, 2011
- Nitto Denko Corporation
- Takahiro Nonaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring circuit board
- Patent number 7,556,850
- Issue date Jul 7, 2009
- Nitto Denko Corporation
- Miyoko Ikishima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Double-sided pressure-sensitive adhesive tape or sheet for wiring c...
- Publication number 20070237949
- Publication date Oct 11, 2007
- Nitto Denko Corporation
- Takahiro Nonaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring circuit board
- Publication number 20070036954
- Publication date Feb 15, 2007
- NITTO DENKO CORPORATION
- Miyoko Ikishima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting adhesive and pressure-sensitive adhesive composition,...
- Publication number 20070036953
- Publication date Feb 15, 2007
- NITTO DENKO CORPORATION
- Takahiro Nonaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...