Miyoshi Togawa

Person

Oita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Camera module, production method, and electronic device
- Patent number 11,356,584
- Issue date Jun 7, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic component and camera module
- Patent number 11,211,300
- Issue date Dec 28, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ryo Itotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and camera module
- Patent number 11,178,759
- Issue date Nov 16, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ryo Itotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, camera module, and method for manufacturing e...
- Patent number 10,917,550
- Issue date Feb 9, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imaging element package and camera module having a slit formed in a...
- Patent number 10,720,459
- Issue date Jul 21, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate for semiconductor device, manufacturing method thereof, s...
- Patent number 7,129,578
- Issue date Oct 31, 2006
- Sony Corporation
- Miyoshi Togawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package having through-holes disposed in the substr...
- Patent number 6,121,686
- Issue date Sep 19, 2000
- Sony Corporation
- Miyoshi Togawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAMERA MODULE, PRODUCTION METHOD, AND ELECTRONIC DEVICE
- Publication number 20210281721
- Publication date Sep 9, 2021
- Sony Semiconductor Solutions Corporation
- YUTA MOMIUCHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC COMPONENT AND CAMERA MODULE
- Publication number 20200098691
- Publication date Mar 26, 2020
- Sony Semiconductor Solutions Corporation
- RYO ITOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND CAMERA MODULE
- Publication number 20190387623
- Publication date Dec 19, 2019
- Sony Semiconductor Solutions Corporation
- RYO ITOTANI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC COMPONENT, CAMERA MODULE, AND METHOD FOR MANUFACTURING E...
- Publication number 20190387145
- Publication date Dec 19, 2019
- Sony Semiconductor Solutions Corporation
- YUTA MOMIUCHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGING ELEMENT PACKAGE AND CAMERA MODULE
- Publication number 20190267418
- Publication date Aug 29, 2019
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- YUTA MOMIUCHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Substrate for semiconductor device, manufacturing method thereof, s...
- Publication number 20020195695
- Publication date Dec 26, 2002
- Miyoshi Togawa
- H01 - BASIC ELECTRIC ELEMENTS

Miyoshi Togawa

Person

Patents Grantslast 30 patents

Camera module, production method, and electronic device

Electronic component and camera module

Electronic component and camera module

Electronic component, camera module, and method for manufacturing e...

Imaging element package and camera module having a slit formed in a...

Substrate for semiconductor device, manufacturing method thereof, s...

Ball grid array package having through-holes disposed in the substr...

Patents Applicationslast 30 patents

CAMERA MODULE, PRODUCTION METHOD, AND ELECTRONIC DEVICE

ELECTRONIC COMPONENT AND CAMERA MODULE

ELECTRONIC COMPONENT AND CAMERA MODULE

ELECTRONIC COMPONENT, CAMERA MODULE, AND METHOD FOR MANUFACTURING E...

IMAGING ELEMENT PACKAGE AND CAMERA MODULE

Substrate for semiconductor device, manufacturing method thereof, s...