Miyuki Harada

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Osaka-shi, JP

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Patents Applicationslast 30 patents

Information Patent Application
THERMALLY-CONDUCTIVE, ELECTRICALLY-CONDUCTIVE ADHESIVE COMPOSITION
- Publication number 20150344749
- Publication date Dec 3, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Matsukazu OCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polymer composite formed article, printed wiring board using the fo...
- Publication number 20070116938
- Publication date May 24, 2007
- Masayuki Tobita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermally-conductive epoxy resin molded article and method of produ...
- Publication number 20040224163
- Publication date Nov 11, 2004
- POLYMATECH CO., LTD.
- Masayuki Tobita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...