Miyuki Suzuki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 11,430,730
- Issue date Aug 30, 2022
- Dai Nippon Printing Co., Ltd.
- Yuki Aritsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through hole electrode substrate with different area weighted avera...
- Patent number 8,288,772
- Issue date Oct 16, 2012
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THROUGH ELECTRODE SUBSTRATE, ELECTRONIC UNIT, METHOD FOR MANUFACTUR...
- Publication number 20220148973
- Publication date May 12, 2022
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi KUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20210134717
- Publication date May 6, 2021
- DAI NIPPON PRINTING CO., LTD.
- Yuki ARITSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH HOLE ELECTRODE SUBSTRATE, METHOD FOR MANUFACTURING THE THRO...
- Publication number 20110062594
- Publication date Mar 17, 2011
- DAI NIPPON PRINTING, CO., LTD.
- Shinji Maekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR