Miyuki UOMOTO

Person

Miyagi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
- Patent number 11,916,038
- Issue date Feb 27, 2024
- Canon Anelva Corporation
- Takayuki Saitoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing structure, and structure
- Patent number 11,569,192
- Issue date Jan 31, 2023
- Shinkawa Ltd.
- Yuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method and joined structure
- Patent number 11,450,643
- Issue date Sep 20, 2022
- Tohoku University
- Takehito Shimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-device manufacturing method and manufacturing apparatus
- Patent number 10,937,758
- Issue date Mar 2, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ATOMIC DIFFUSION BONDING AND BONDED STRUCTURE
- Publication number 20230083722
- Publication date Mar 16, 2023
- TOHOKU UNIVERSITY
- Takehito SHIMATSU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...
- Publication number 20230051810
- Publication date Feb 16, 2023
- Canon ANELVA Corporation
- Takayuki SAITOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL BONDING METHOD AND JOINED STRUCTURE
- Publication number 20220199569
- Publication date Jun 23, 2022
- TOHOKU UNIVERSITY
- Takehito SHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD AND JOINED STRUCTURE
- Publication number 20220157770
- Publication date May 19, 2022
- TOHOKU UNIVERSITY
- Takehito SHIMATSU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE BODY, STRUCTURE BODY MANUFACTURING METHOD, AND ELECTRONIC...
- Publication number 20220055343
- Publication date Feb 24, 2022
- SONY GROUP CORPORATION
- Yuichi TAKAHASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
STRUCTURE AND EXTERIOR HOUSING
- Publication number 20220032582
- Publication date Feb 3, 2022
- SONY GROUP CORPORATION
- Yuichi TAKAHASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
FUNCTIONAL ELEMENT AND METHOD OF MANUFACTURING FUNCTIONAL ELEMENT,...
- Publication number 20200369000
- Publication date Nov 26, 2020
- SONY CORPORATION
- YOSHIHISA SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE
- Publication number 20200083190
- Publication date Mar 12, 2020
- SHINKAWA LTD.
- Yuji EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20200006282
- Publication date Jan 2, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS

Miyuki UOMOTO

Person

Patents Grantslast 30 patents

Chemical bonding method, package-type electronic component, and hyb...

Method for producing structure, and structure

Chemical bonding method and joined structure

Semiconductor-device manufacturing method and manufacturing apparatus

Patents Applicationslast 30 patents

METHOD FOR ATOMIC DIFFUSION BONDING AND BONDED STRUCTURE

CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...

CHEMICAL BONDING METHOD AND JOINED STRUCTURE

CHEMICAL BONDING METHOD AND JOINED STRUCTURE

STRUCTURE BODY, STRUCTURE BODY MANUFACTURING METHOD, AND ELECTRONIC...

STRUCTURE AND EXTERIOR HOUSING

FUNCTIONAL ELEMENT AND METHOD OF MANUFACTURING FUNCTIONAL ELEMENT,...

METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE

SEMICONDUCTOR-DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS