Miyuki Wakao

Person

Annaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin containing silicone-modified epoxy resin and polyvalent...
- Patent number 10,308,803
- Issue date Jun 4, 2019
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicone-modified epoxy resin, composition containing the epoxy res...
- Patent number 9,963,542
- Issue date May 8, 2018
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicone-modified epoxy resin, composition containing said epoxy re...
- Patent number 9,944,760
- Issue date Apr 17, 2018
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silicone-modified epoxy resin and composition and cured article the...
- Patent number 9,777,107
- Issue date Oct 3, 2017
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Addition-curable silicone resin composition and die attach material...
- Patent number 9,660,157
- Issue date May 23, 2017
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wavelength conversion sheet filled with large amount of phosphor, m...
- Patent number 9,147,818
- Issue date Sep 29, 2015
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy composition for encapsulating an optical semiconductor element
- Patent number 8,710,158
- Issue date Apr 29, 2014
- Shin-Etsu Chemical Co., Ltd.
- Manabu Ueno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition for encapsulating optical semiconductor element
- Patent number 8,133,957
- Issue date Mar 13, 2012
- Shin-Etsu Chemical Co., Ltd.
- Yoshihira Hamamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Diglycidylisocyanuryl-modified organopolysiloxane and composition c...
- Patent number 7,985,806
- Issue date Jul 26, 2011
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor-encapsulating epoxy resin composition, preparation me...
- Patent number 7,910,638
- Issue date Mar 22, 2011
- Shin-Etsu Chemical Co., Ltd.
- Tomoyoshi Tada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Optical device-related adhesive and optical device
- Patent number 6,709,756
- Issue date Mar 23, 2004
- Shin-Etsu Chemical Co., Ltd.
- Haruyoshi Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition, laminate film using the same, and semicond...
- Patent number 6,512,031
- Issue date Jan 28, 2003
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition
- Patent number 6,506,822
- Issue date Jan 14, 2003
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device sealing material and flip-chip...
- Patent number 6,429,238
- Issue date Aug 6, 2002
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, laminate film using the same, and semicond...
- Patent number 6,383,659
- Issue date May 7, 2002
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device sealing material and flip-chip...
- Patent number 6,376,923
- Issue date Apr 23, 2002
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device sealing material and flip-chip...
- Patent number 6,294,271
- Issue date Sep 25, 2001
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip type semiconductor device
- Patent number 6,225,704
- Issue date May 1, 2001
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition, laminate film using the same, and semicond...
- Patent number 6,210,811
- Issue date Apr 3, 2001
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Quaternary phosphorus compounds and their preparation
- Patent number 5,473,091
- Issue date Dec 5, 1995
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Organic silicon compounds
- Patent number 5,336,786
- Issue date Aug 9, 1994
- Shin-Etsu Chemical Company, Limited
- Toshio Shiobara
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING THE EPOXY RES...
- Publication number 20170107322
- Publication date Apr 20, 2017
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING SAID EPOXY RE...
- Publication number 20170073457
- Publication date Mar 16, 2017
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADDITION-CURABLE SILICONE RESIN COMPOSITION AND DIE ATTACH MATERIAL...
- Publication number 20160251482
- Publication date Sep 1, 2016
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya YAMAZAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE-MODIFIED EPOXY RESIN AND COMPOSITION AND CURED ARTICLE THE...
- Publication number 20160237202
- Publication date Aug 18, 2016
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin Containing Silicone-Modified Epoxy Resin and Polyvalent...
- Publication number 20160177085
- Publication date Jun 23, 2016
- Nippon Kayaku Kabushiki-Kaisha
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WAVELENGTH CONVERSION SHEET FILLED WITH LARGE AMOUNT OF PHOSPHOR, M...
- Publication number 20130113008
- Publication date May 9, 2013
- SHIN-ETSU CHEMICAL CO., LTD.
- Toshio SHIOBARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PRODUCING CURED THIN FILM USING PHOTOCURABLE SILICONE RES...
- Publication number 20130072592
- Publication date Mar 21, 2013
- SHIN-ETSU CHEMICAL CO., LTD.
- Kenichi INAFUKU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD FOR CURING A SILICONE RESIN COMPOSITION
- Publication number 20120142803
- Publication date Jun 7, 2012
- Shin-Etsu Chemical Co., Ltd.
- Kenichi INAFUKU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
EPOXY COMPOSITION FOR ENCAPSULATING AN OPTICAL SEMICONDUCTOR ELEMENT
- Publication number 20110251305
- Publication date Oct 13, 2011
- Manabu Ueno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT
- Publication number 20100029887
- Publication date Feb 4, 2010
- Yoshihira Hamamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIGLYCIDYLISOCYANURYL-MODIFIED ORGANOPOLYSILOXANE AND COMPOSITION C...
- Publication number 20090203822
- Publication date Aug 13, 2009
- Toshio SHIOBARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION ME...
- Publication number 20090192258
- Publication date Jul 30, 2009
- Shin-Etsu Chemical Co., Ltd.
- Tomoyoshi Tada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Optical device-related adhesive and optical device
- Publication number 20030010962
- Publication date Jan 16, 2003
- Haruyoshi Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy resin composition
- Publication number 20020022681
- Publication date Feb 21, 2002
- Nobuhiro Ichiroku
- H01 - BASIC ELECTRIC ELEMENTS

Miyuki Wakao

Person

Patents Grantslast 30 patents

Epoxy resin containing silicone-modified epoxy resin and polyvalent...

Silicone-modified epoxy resin, composition containing the epoxy res...

Silicone-modified epoxy resin, composition containing said epoxy re...

Silicone-modified epoxy resin and composition and cured article the...

Addition-curable silicone resin composition and die attach material...

Wavelength conversion sheet filled with large amount of phosphor, m...

Epoxy composition for encapsulating an optical semiconductor element

Resin composition for encapsulating optical semiconductor element

Diglycidylisocyanuryl-modified organopolysiloxane and composition c...

Semiconductor-encapsulating epoxy resin composition, preparation me...

Optical device-related adhesive and optical device

Epoxy resin composition, laminate film using the same, and semicond...

Epoxy resin composition

Flip-chip type semiconductor device sealing material and flip-chip...

Epoxy resin composition, laminate film using the same, and semicond...

Flip-chip type semiconductor device sealing material and flip-chip...

Flip-chip type semiconductor device sealing material and flip-chip...

Flip-chip type semiconductor device

Epoxy resin composition, laminate film using the same, and semicond...

Quaternary phosphorus compounds and their preparation

Organic silicon compounds

Patents Applicationslast 30 patents

SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING THE EPOXY RES...

SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING SAID EPOXY RE...

ADDITION-CURABLE SILICONE RESIN COMPOSITION AND DIE ATTACH MATERIAL...

SILICONE-MODIFIED EPOXY RESIN AND COMPOSITION AND CURED ARTICLE THE...

Epoxy Resin Containing Silicone-Modified Epoxy Resin and Polyvalent...

WAVELENGTH CONVERSION SHEET FILLED WITH LARGE AMOUNT OF PHOSPHOR, M...

METHOD OF PRODUCING CURED THIN FILM USING PHOTOCURABLE SILICONE RES...

METHOD FOR CURING A SILICONE RESIN COMPOSITION

EPOXY COMPOSITION FOR ENCAPSULATING AN OPTICAL SEMICONDUCTOR ELEMENT

RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT

DIGLYCIDYLISOCYANURYL-MODIFIED ORGANOPOLYSILOXANE AND COMPOSITION C...

SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION ME...

Optical device-related adhesive and optical device

Epoxy resin composition