Mo Bai

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Fluid coupling mating apparatus and method
- Patent number 10,292,308
- Issue date May 14, 2019
- FutureWei Technologies, Inc.
- Mo Bai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stationary cooling structure for board/chassis-level conduction coo...
- Patent number 10,117,357
- Issue date Oct 30, 2018
- FutureWei Technologies, Inc.
- Mo Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat spreader with thermally coductive foam core
- Patent number 9,813,082
- Issue date Nov 7, 2017
- FutureWei Technologies, Inc.
- Mo Bai
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Heat Spreader with Thermally Coductive Foam Core
- Publication number 20170104500
- Publication date Apr 13, 2017
- FutureWei Technologies, Inc.
- Mo Bai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID COUPLING MATING APPARATUS AND METHOD
- Publication number 20170030497
- Publication date Feb 2, 2017
- FutureWei Technologies, Inc.
- Mo Bai
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
STATIONARY COOLING STRUCTURE FOR BOARD/CHASSIS-LEVEL CONDUCTION COO...
- Publication number 20170027083
- Publication date Jan 26, 2017
- FutureWei Technologies, Inc.
- Mo Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR