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Mohamad Yazid Wagiman
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Pre-molded lead frames for semiconductor packages
Patent number
11,699,647
Issue date
Jul 11, 2023
Infineon Technologies AG
Balehithlu Manjappaiah Upendra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe, semiconductor package and support lead for bonding with...
Patent number
7,875,968
Issue date
Jan 25, 2011
Infineon Technologies AG
Wu Hu Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
Publication number
20230307328
Publication date
Sep 28, 2023
INFINEON TECHNOLOGIES AG
Balehithlu Manjappaiah UPENDRA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
Publication number
20220336340
Publication date
Oct 20, 2022
INFINEON TECHNOLOGIES AG
Balehithlu Manjappaiah UPENDRA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A SEMICONDUCTOR PA...
Publication number
20210305135
Publication date
Sep 30, 2021
INFINEON TECHNOLOGIES AG
Mohamad Yazid Bin WAGIMAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe and Semiconductor Package
Publication number
20080128741
Publication date
Jun 5, 2008
Wu Hu Li
H01 - BASIC ELECTRIC ELEMENTS