Mohamad Yazid Wagiman

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,199,019
- Issue date Jan 14, 2025
- Infineon Technologies AG
- Mohamad Yazid Bin Wagiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded lead frames for semiconductor packages
- Patent number 11,699,647
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor package and support lead for bonding with...
- Patent number 7,875,968
- Issue date Jan 25, 2011
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230307328
- Publication date Sep 28, 2023
- INFINEON TECHNOLOGIES AG
- Balehithlu Manjappaiah UPENDRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
- Publication number 20220336340
- Publication date Oct 20, 2022
- INFINEON TECHNOLOGIES AG
- Balehithlu Manjappaiah UPENDRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A SEMICONDUCTOR PA...
- Publication number 20210305135
- Publication date Sep 30, 2021
- INFINEON TECHNOLOGIES AG
- Mohamad Yazid Bin WAGIMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and Semiconductor Package
- Publication number 20080128741
- Publication date Jun 5, 2008
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS